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Zhejiang Lingchao Electronic Technology Co., Ltd., a seasoned player in the electronic manufacturing industry, continues to strengthen its position as a comprehensive provider of high-performance circuit board solutions. With over two decades of dedicated development, the company has evolved from a small workshop into a modern enterprise equipped with cutting-edge production lines and a full range of quality assurance systems. Today, it serves a broad spectrum of clients across automotive, medical, LED lighting, consumer electronics, communication, and industrial control sectors, both domestically and internationally. At the heart of Lingchao’s success lies its deep expertise in producing various types of circuit boards. The company specializes in single sided electronic circuit board designs for cost-effective applications, as well as double sided electronic circuit board configurations that offer higher density and reliability. For more complex systems, the company provides multi-layer electronic circuit board solutions, including FR-4 multilayer circuit boards that meet stringent performance requirements. Additionally, the company excels in manufacturing printed circuit board variants with advanced surface finishes such as Nickel Gold Plate Series, Spray Tin Plate Series, and high-quality OSP Antioxidant Board, ensuring excellent solderability and corrosion resistance for diverse environments. Recognising the growing demand for flexible interconnects, Lingchao has also developed a strong portfolio in FPC flexible boards and soft hard combination boards. These products are ideal for compact, lightweight, and dynamic applications where rigid boards cannot suffice. The company’s FPC Flexible Board Series and soft hard combination board series are produced with precision equipment, ensuring fine pitch, high flexibility, and durability. Meanwhile, for standard rigid requirements, the FR-4 and CEM-3 double-sided circuit board options provide a balanced mix of performance and cost-efficiency, widely used in power supplies and consumer electronics. To maintain consistent quality and rapid delivery, Lingchao has invested heavily in advanced machinery, including automatic optical inspection systems, laser direct imaging (LDI) exposure machines, vertical continuous electroplating lines, and CNC drilling/milling equipment. These facilities enable the company to handle complex orders with tight tolerances and diverse material requirements. The production process covers lead-free finishes such as immersion tin, immersion silver, electroless nickel/gold, and OSP, complying with global environmental regulations. The company’s commitment to excellence is validated by multiple certifications, including IATF16949 and ISO9001 for quality management, ISO14001 for environmental management, CQC mark, and UL product certification. These accreditations reflect Lingchao’s systematic approach to process control, traceability, and continuous improvement. As a recognised National High-tech and Innovation Star enterprise, Lingchao prioritises R&D to stay ahead of industry trends, regularly refining its manufacturing processes and material selection. With a factory area of 30 acres and over 300 skilled employees, the company operates from its modern headquarters in Wenzhou’s Pingyang Binhai New Area, benefiting from excellent logistics and supporting infrastructure. Its sales network covers mainland China and extends to Europe, North America, and Asia-Pacific regions. Lingchao’s integrated service model—from engineering support to prototyping and mass production—ensures seamless project execution for clients of all sizes. Looking forward, Zhejiang Lingchao Electronic Technology Co., Ltd. remains dedicated to the principles of integrity, quality-driven survival, technological innovation, and industry-leading pursuit. The company warmly invites global partners to explore collaborative opportunities and experience its reliable, high-performance electronic board solutions. For inquiries, please contact:Mr. XuEmail: mr.xu@lingchaopcb.comPhone: +86 13780181891

Zhejiang Lingchao Electronic Technology Co., Ltd., a seasoned manufacturer in the electronic interconnection industry, has announced a significant upgrade to its manufacturing infrastructure and product portfolio. With a history tracing back to 1998, the company has evolved from a modest workshop into a modern enterprise occupying a 30‑acre facility with 50,000 square metres of floor space in Wenzhou’s Pingyang Binhai New Area. This strategic expansion, supported by an investment of approximately 100 million RMB, underscores the company’s commitment to meeting the growing demand for high‑reliability interconnection solutions across diverse sectors.   The company’s core strength lies in its ability to produce a wide spectrum of products, ranging from basic single‑sided constructions to complex multi‑layer configurations. Every circuit board leaving the factory undergoes rigorous quality checks, ensuring consistent electrical performance and mechanical durability. For applications requiring lightweight and flexible interconnections, the company has developed dedicated production lines for the FPC Flexible Board Series&soft Hard Combination Board Series, which are increasingly sought after in wearable devices, foldable displays, and compact medical instruments. These flexible solutions are engineered to withstand repeated bending while maintaining signal integrity, a critical requirement in modern portable electronics.   In the rigid board category, the company offers comprehensive options to suit various design and cost constraints. The Single sided electronic circuit board remains a cost‑effective choice for simple consumer products, while the Double sided electronic circuit board provides higher routing density for more complex assemblies. For advanced industrial and communication equipment, the Multi‑layer electronic circuit board delivers superior power distribution and noise suppression, with layer counts tailored to customer specifications. Additionally, the Printed circuit board family includes specialised substrates such as FR‑4 and CEM‑3 materials, ensuring compatibility with lead‑free assembly processes and high‑temperature environments.   To support these diverse product lines, the factory has integrated state‑of‑the‑art equipment from both domestic and international suppliers. The investment in laser direct imaging exposure machines, automatic optical inspection systems, and vertical continuous copper plating lines enables fine‑line patterning and consistent plating thickness. The DES (develop‑etch‑strip) lines, coupled with dry film lamination and CNC drilling/milling stations, allow for rapid prototyping and high‑volume production with minimal lead times. Quality assurance is further reinforced by four‑wire flying probe testers, metallographic microscopes, and precision measurement systems, which monitor every critical parameter from incoming raw materials to finished boards.   Surface finish technology is another area where the company demonstrates technical prowess. The facility offers a full range of lead‑free finishes, including immersion tin, immersion silver, electroless nickel/immersion gold, and OSP (organic solderability preservatives). The OSP Antioxidant Board,high‑quality OSP Antioxidant Board is particularly popular for its flat surface and cost efficiency in fine‑pitch assembly, while the Nickel Gold Plate Series provides excellent corrosion resistance and wire‑bonding capability for high‑reliability applications. The Spray Tin Plate Series (hot air solder leveling) remains a robust option for through‑hole components and harsh environments. For multilayer designs, the FR‑4 Multilayer Circuit Board delivers a balanced combination of mechanical strength, thermal stability, and dielectric performance, making it a preferred choice for power supplies and automotive control units. Meanwhile, the FR‑4, CEM‑3 Double‑sided Circuit Board offers an economical alternative for medium‑complexity designs without compromising on insulation or moisture resistance.   Beyond rigid boards, the company has invested heavily in flexible and rigid‑flex technologies. The FPC boards and flexible circuit boards are manufactured using advanced polyimide substrates, enabling dynamic flexing in robotic arms and hinge‑type devices. The soft hard combination boards integrate rigid sections for component mounting and flexible sections for dynamic interconnection, reducing overall system weight and eliminating connector failure points. These hybrid solutions are increasingly adopted in automotive camera modules, drone gimbals, and portable diagnostic equipment.   Zhejiang Lingchao’s quality management systems have earned international recognition, including IATF16949 and ISO9001 certifications for automotive and general industrial applications, ISO14001 for environmental stewardship, and UL product safety listing. The company also holds CQC mark certification for the Chinese market. These accreditations reflect a corporate culture that prioritises traceability, continuous improvement, and customer satisfaction. The engineering team routinely collaborates with clients to optimise panel utilisation, impedance control, and thermal management, ensuring that each design translates into a manufacturable and reliable product.   The company’s sales network covers all major regions of China, with export shipments reaching Europe, North America, and Asia‑Pacific nations. Typical end‑use sectors include automotive electronics, medical instrumentation, LED lighting, household appliances, consumer gadgets, computing peripherals, telecom infrastructure, and industrial control systems. By maintaining a flexible production model, the company can accommodate both prototype quantities and large‑scale orders, with typical lead times ranging from five to fifteen working days depending on complexity.   Looking ahead, the management team has outlined a roadmap for further technological advancement, including research into higher‑frequency materials, thinner cores, and embedded passive components. The recent expansion of the engineering department and the addition of a dedicated R&D centre within the new factory premises are clear indicators of the company’s long‑term vision. As electronic devices become more compact and powerful, the demand for high‑density interconnections will continue to rise, and Zhejiang Lingchao is well positioned to serve this evolving market with its integrated capabilities, rigorous quality culture, and customer‑centric approach.   In summary, the company’s journey from a family‑run workshop to a leading PCB manufacturer exemplifies the successful combination of strategic investment, technological adoption, and unwavering commitment to quality. With its comprehensive product portfolio covering everything from simple single‑sided boards to complex rigid‑flex assemblies, and its full suite of surface finishes, the company offers a one‑stop solution for engineers and procurement professionals worldwide. The future holds further milestones as the company continues to innovate and expand, always with the goal of delivering exceptional value and reliability to its global customer base.   Email: mr.xu@lingchaopcb.comPhone: +86 13780181891

Zhejiang Lingchao Electronic Technology Co., Ltd., a distinguished name in the Chinese electronics manufacturing sector, is proud to announce a significant milestone in its continuous journey of technological enhancement and capacity expansion. Since its founding in 1998, the enterprise has evolved from a modest workshop into a modern, large‑scale facility occupying 50,000 square meters in Wenzhou’s Pingyang Binhai New Area. Today, with over 300 skilled employees and an investment exceeding 100 million RMB, the company stands as a reliable partner for clients across the globe, delivering high‑performance solutions that meet the most demanding industry standards.   The latest upgrade involves the integration of state‑of‑the‑art production and inspection equipment, including laser direct imaging (LDI) exposure machines, VCP automatic electroplating lines, dry film automatic laminators, and DES (develop‑etch‑strip) lines. These additions enable the company to manufacture a broader spectrum of products with enhanced precision and consistency. Among the key offerings, the Printed circuit board remains the core product, available in various configurations to suit diverse applications. Customers can choose from Single sided electronic circuit board for simple, cost‑effective designs, or opt for Double sided electronic circuit board and Multi-layer electronic circuit board for more complex circuitry requiring higher density and signal integrity. For advanced interconnect solutions, the company has also ramped up production of FPC Flexible Board Series&soft Hard Combination Board Series, which includes FPC boards, flexible circuit boards, and soft hard combination boards that are increasingly sought after in wearable devices, foldable displays, and compact automotive modules.   In parallel, Zhejiang Lingchao has made substantial progress in surface finishing technologies, a critical factor for solderability, corrosion resistance, and long‑term reliability. The company now operates dedicated lines for the Nickel Gold Plate Series, offering excellent flatness and oxidation protection for fine‑pitch components, and the Spray Tin Plate Series, which provides a robust, lead‑free coating suitable for through‑hole and surface‑mount assemblies. For environmentally conscious applications, the OSP Antioxidant Board and high-quality OSP Antioxidant Board are available, delivering a thin, organic protective layer that preserves copper pad integrity during assembly while avoiding the use of heavy metals. These finishes are complemented by other lead‑free processes such as immersion tin, immersion silver, and electroless nickel/immersion gold, ensuring that every Electronic board leaving the factory meets global environmental directives like RoHS and REACH.   Quality assurance remains the cornerstone of the company’s philosophy. The facility is fully certified under IATF16949 and ISO9001 quality management systems, ISO14001 for environmental stewardship, as well as CQC and UL product certifications. These accreditations underscore the company’s dedication to delivering defect‑free products, from prototype to mass production. Every batch undergoes rigorous testing using automatic optical inspection (AOI), flying probe testers, metallographic microscopes, and precision imaging measurement systems. This comprehensive quality regime guarantees that each FR-4 Multilayer Circuit Board and FR-4, CEM-3 Double-sided Circuit Board performs reliably in harsh environments, whether under the hood of a vehicle, inside a medical monitor, or within a telecom base station.   The company’s product portfolio now covers automotive electronics, medical instruments, LED lighting, household appliances, consumer electronics, computer peripherals, communication infrastructure, and industrial control systems. With a dedicated R&D team that continuously explores cutting‑edge processes, Zhejiang Lingchao has developed proprietary expertise in high‑frequency materials, impedance control, and thermal management for aluminum‑based boards. This technical versatility allows the company to serve both high‑volume commercial orders and specialized niche requirements with equal agility.   Geographically, the Wenzhou location offers exceptional logistical advantages, being adjacent to major highways and ports, which facilitates swift delivery to domestic and international customers. Export markets include Europe, North America, and Asia‑Pacific regions, where the company has built a reputation for on‑time delivery, transparent communication, and flexible service models. The management team adheres to a cultural creed of “integrity as foundation, quality as survival, technological innovation, and industry‑leading pursuit,” which permeates every level of the organization.   Looking ahead, Zhejiang Lingchao Electronic Technology Co., Ltd. plans to further invest in intelligent manufacturing and green production initiatives. The upcoming expansion will include additional capacity for flexible and rigid‑flex boards, as well as enhanced R&D facilities for next‑generation substrate materials. By combining advanced machinery, rigorous quality systems, and a customer‑centric approach, the company is well‑positioned to sustain its upward trajectory in the competitive global circuit board market. Clients are invited to explore the full range of capabilities, from prototype sampling to volume production, and experience a seamless partnership that prioritizes excellence from design to delivery. With its proven track record and forward‑looking strategy, Zhejiang Lingchao remains a preferred partner for original equipment manufacturers and electronic manufacturing service providers worldwide.

Zhejiang Lingchao Electronic Technology Co., Ltd., a renowned manufacturer with over two decades of experience in the electronics industry, is proud to announce a series of significant upgrades to its production facilities and quality management systems. These improvements reinforce the company’s commitment to delivering superior quality circuit boards to a diverse range of high-technology sectors, including automotive electronics, medical instruments, light emitting diode lighting, consumer electronics, communication equipment, and industrial control systems.   The company has recently commissioned a new generation of intelligent manufacturing equipment, including advanced laser direct imaging exposure machines, high-precision computer numerical control drilling and milling machines, and fully automated vertical continuous copper plating lines. These additions, combined with the existing automatic optical inspection systems and metallographic microscopes, enable Lingchao to achieve unprecedented precision and consistency in the production of both rigid and flexible substrates. The enhanced capabilities are particularly beneficial for producing complex multi-layer electronic circuit boards, which are increasingly demanded by the automotive and telecommunications industries.   In addition to hardware investments, the company has also upgraded its chemical treatment processes to support a full range of lead‑free surface finishes. Customers can now choose from environmentally friendly options such as organic solderability preservatives, immersion silver, immersion tin, electroless nickel immersion gold, and electroplated nickel‑gold. These finishes are applied to various product lines, including single sided electronic circuit boards for simple consumer devices, double sided electronic circuit boards for more intricate applications, and high‑density interconnect boards. Notably, the company’s expertise extends to FR‑4 multilayer circuit boards, which offer excellent mechanical strength and thermal stability for demanding environments.   The expansion also addresses the growing need for flexible and rigid‑flex solutions. Lingchao now offers flexible printed circuit boards and soft‑hard combination boards, which are essential for wearable devices, foldable displays, and compact medical sensors. These products undergo rigorous testing using four‑wire flying probe testers and automated testing machine combinations to ensure electrical integrity and reliability.   Quality assurance remains the cornerstone of Lingchao’s operations. The enterprise maintains IATF16949 and ISO9001 certifications for quality management, alongside ISO14001 for environmental management, and Underwriters Laboratories product safety certification. These accreditations demonstrate the company’s adherence to international standards and its proactive approach to sustainable manufacturing. Recently, the company successfully passed a rigorous audit by a major European automotive supplier, paving the way for increased exports to the European and North American markets.   With a modern factory covering fifty thousand square meters and a skilled workforce of over three hundred employees, Zhejiang Lingchao Electronic Technology Co., Ltd. is well‑positioned to handle large‑volume orders while maintaining flexibility for prototype and small‑batch production. The company’s integrated service model covers everything from engineering design support to rapid prototyping and mass production, ensuring seamless project execution.   Looking ahead, Lingchao plans to further invest in research and development, focusing on advanced materials and ultra‑thin substrates for next‑generation electronic devices. By combining state‑of‑the‑art equipment, rigorous quality control, and a customer‑centric approach, the company aims to solidify its reputation as a preferred partner for printed circuit board solutions worldwide. Customers are invited to contact the sales team for more information on how Lingchao’s diversified product portfolio can meet specific application requirements, from basic single‑sided designs to complex multilayer and flexible configurations.

Zhejiang Lingchao Electronic Technology Co., Ltd., a prominent name in the electronics manufacturing sector, has continuously strengthened its capabilities to meet the evolving demands of global clients. The company, which has grown from a modest workshop to a large-scale enterprise, now operates a sprawling 50,000‑square‑meter factory in the Pingyang Binhai area of Wenzhou, Zhejiang Province. This facility is equipped with an extensive range of intelligent production and quality control systems, including automatic optical hole inspection machines, automatic optical inspection scanners, precision imaging measurement and control systems, metallographic microscopes, automatic testing machine combinations, four‑wire flying needle testing machines, two‑wire flying needle testing machines, computer numerical control drilling machines, computer numerical control milling machines, laser direct imaging exposure units, vertical continuous copper plating lines, dry film automatic laminating machines, and development‑etching‑stripping lines. Such advanced machinery enables the company to produce a vast array of products with exceptional precision and consistency. The company's product portfolio encompasses virtually every type of interconnection solution. It manufactures single sided electronic circuit board and double sided electronic circuit board for simpler applications, as well as multi-layer electronic circuit board for complex, high‑density designs. For thermal management, the company offers aluminum‑based boards, while for flexible and three‑dimensional packaging, it provides FPC Flexible Board Series&soft Hard Combination Board Series. Additionally, the company excels in producing FPC boards,flexible circuit boards,soft hard combination boards, which are essential for modern portable and wearable electronics. Surface finish options are equally diverse, featuring lead‑free spray tin, electroplated nickel gold, electroless tin, electroless silver, electroless nickel gold, and oxidation‑resistant coatings. Among these, the OSP Antioxidant Board,high-quality OSP Antioxidant Board is particularly popular for its cost‑effectiveness and reliability, while the Nickel Gold Plate Series and Spray Tin Plate Series are chosen for harsh operating conditions. For high‑frequency and high‑reliability applications, the FR-4 Multilayer Circuit Board and FR-4, CEM-3 Double-sided Circuit Board are manufactured to stringent tolerances. Every printed circuit board leaving the factory undergoes comprehensive electrical and mechanical testing to ensure flawless functionality. These products find widespread use in automotive electronics, medical instruments, LED lighting, household appliances, consumer electronics, computer peripherals, communication infrastructure, and industrial automation. The company's commitment to quality is validated by its successful attainment of IATF16949 and ISO9001 quality management system certifications, ISO14001 environmental management certification, CQC logo certification, and UL product certification. These credentials, together with its recognition as a National High‑tech and Innovation Star enterprise, underscore its technical prowess and operational excellence. The enterprise has also developed various lead‑free processes, such as electroless tin, electroless silver, and oxidation‑resistant finishes, aligning with global environmental regulations and customer preferences for sustainable manufacturing. With a robust sales network covering domestic China and exports to Europe, North America, and Asia‑Pacific regions, the company leverages its strategic location to ensure efficient logistics and responsive customer service. Adhering to a corporate philosophy that emphasizes integrity, quality, innovation, and industry leadership, the company continuously invests in process development and staff training. Every circuit board is subjected to rigorous inspection and testing to guarantee performance and durability. By offering integrated services from design support to mass production, Zhejiang Lingchao Electronic Technology Co., Ltd. enables customers to shorten time‑to‑market and reduce total cost of ownership. The company remains dedicated to expanding its technological edge and fostering long‑term partnerships with clients worldwide. Through persistent improvement and customer‑centricity, it aims to set new benchmarks in the electronic board industry, ensuring that each product – whether a simple single‑sided design or a complex multilayer assembly – meets the highest standards of quality and reliability. The company's engineering team continuously refines manufacturing parameters, utilising real‑time data from automated inspection systems to drive zero‑defect production. Furthermore, the firm actively collaborates with research institutions to explore next‑generation materials and processes, reinforcing its position as a forward‑thinking supplier. With its comprehensive capabilities, stringent quality管理体系, and customer‑first approach, Zhejiang Lingchao Electronic Technology Co., Ltd. stands ready to support diverse application needs, from prototype development to high‑volume orders, all while maintaining competitive lead times and transparent communication. This holistic strategy ensures that the company not only meets but exceeds the expectations of its global clientele, solidifying its reputation as a trusted partner in the ever‑advancing world of electronic interconnectivity.

Zhejiang Lingchao Electronic Technology Co., Ltd., a pioneering enterprise in the printed circuit board industry, is proud to announce its continued commitment to innovation and quality in the production of diverse electronic board solutions. With over two decades of development, the company has transformed from a small workshop into a leading manufacturer, now equipped with state-of-the-art production lines and rigorous quality control systems. Our product portfolio encompasses a wide range of offerings, including the single sided electronic circuit board, the double sided electronic circuit board, and the multi-layer electronic circuit board, all designed to meet the stringent requirements of modern electronics. Additionally, we specialize in advanced substrates such as FR-4 multilayer circuit boards, CEM-3 double-sided boards, and flexible circuit boards including the FPC flexible board series and the soft-hard combination board series. These products are widely applied in automotive electronics, medical instruments, LED lighting, consumer electronics, communication equipment, and industrial control systems.   Our manufacturing facility, located in Wenzhou’s Pingyang Binhai New Area, spans 50,000 square meters and houses advanced intelligent equipment sourced from leading domestic and international suppliers. The production floor features automatic optical hole inspection machines, AOI optical scanning and maintenance systems, precision imaging measurement and control equipment, metallographic microscopes, automatic testing machine combinations, four-wire flying probe testers, two-wire flying probe testers, CNC drilling machines, CNC milling machines, laser direct imaging (LDI) exposure units, VCP automatic electroplating lines (vertical continuous copper plating), dry film automatic laminators, and DES (developing-etching-stripping) lines. This comprehensive machinery enables us to maintain strict process control and deliver consistent product quality across all our electronic board families.   In terms of surface finishing, we have mastered a variety of cutting-edge processes that support lead-free and environmentally friendly production. Our capabilities include lead-free tin spraying, electro nickel gold, chemical tin deposition, chemical silver deposition, chemical nickel gold deposition, and oxidation resistance (OSP) treatments. We offer a full range of surface options, such as the nickel gold plate series, the spray tin plate series, and the high-quality OSP antioxidant board, ensuring that every printed circuit board meets the specific corrosion resistance, solderability, and electrical performance required by our customers. For high-frequency and high-reliability applications, our FR-4 multilayer circuit boards and FR-4/CEM-3 double-sided circuit boards provide excellent mechanical strength and thermal stability.   Quality assurance is the cornerstone of our operations. The enterprise has successfully passed IATF16949 and ISO9001 quality management system certification, ISO14001 environmental management system certification, CQC logo certification, and UL product certification. These accreditations reflect our unwavering dedication to international standards and continuous improvement. We have also been honored with the titles of National High-tech Enterprise and Innovation Star, recognising our contributions to technological advancement in the printed circuit board sector. Our quality team performs rigorous incoming material inspection, in-process monitoring, and final electrical testing, utilising advanced equipment such as four-wire flying probe testers and metallographic microscopes to guarantee zero-defect shipments.   Beyond manufacturing, we pride ourselves on delivering integrated PCB services that cover the entire product lifecycle. From initial design consultation and prototype development to volume production and just-in-time delivery, our professional team ensures seamless communication and rapid turnaround. Our geographical location in the Pingyang Binhai New Area offers superior transportation links, simplifying logistics for both domestic and export orders. We serve a diverse clientele spanning automotive parts suppliers, medical device manufacturers, LED lighting brands, household appliance producers, consumer electronics companies, computer hardware makers, communication infrastructure builders, and industrial control system integrators. Our products are mainly sold across China and exported to Europe, North America, and several Asia-Pacific countries, reflecting our global reach and reliability.   As we look forward, we remain focused on expanding our technological edge, particularly in the field of flexible and rigid-flex solutions. The FPC flexible board series and the soft-hard combination board series are gaining increasing traction in wearable devices, foldable displays, and compact automotive modules, where space and weight savings are critical. By investing in research and development, we continuously refine our processes for both rigid and flexible substrates, ensuring that every single sided electronic circuit board, double sided electronic circuit board, and multi-layer electronic circuit board we produce adheres to the highest performance benchmarks. Our commitment to integrity, quality-driven survival, scientific and technological innovation, and the pursuit of industry-leading standards forms the bedrock of our corporate culture. We invite customers and partners from around the world to collaborate with us, leveraging our comprehensive capabilities to bring their electronic designs to life with efficiency, precision, and unwavering quality.

Zhejiang Lingchao Electronic Technology Co., Ltd., a distinguished manufacturer in the electronic interconnection industry, continues to expand its production capabilities and product offerings to serve diverse high-technology sectors including communication equipment, automotive electronics, household appliances, medical instruments, financial equipment, and LED lighting. With a total investment of approximately 100 million yuan, a factory covering 30 acres, a building area of 50,000 square meters, and a skilled team of more than 300 employees, the company stands as a reliable partner for customers across China, Europe, North America, and the Asia-Pacific region. The company’s core expertise lies in manufacturing various types of circuit board solutions. Its extensive product line includes the Single sided electronic circuit board, which is widely used in simple and cost-effective electronic assemblies, and the Double sided electronic circuit board, which offers higher density and more complex interconnection for consumer electronics and industrial controls. For applications demanding greater functionality and compact design, the company produces the Multi-layer electronic circuit board, enabling advanced routing and signal integrity in communication systems and computing devices. Another essential category is the Printed circuit board in its various forms, all manufactured under strict quality management systems certified to IATF16949, ISO9001, and ISO14001. Beyond rigid boards, Zhejiang Lingchao has developed specialized flexible solutions. The FPC Flexible Board Series & soft Hard Combination Board Series provides outstanding design flexibility for wearable devices, medical equipment, and automotive displays where space and weight are critical. These products include FPC boards, flexible circuit boards, and soft hard combination boards, each engineered to withstand dynamic bending and vibration while maintaining reliable electrical connections. The company also offers a wide selection of surface finishes and base material variants to meet different environmental and performance requirements. The OSP Antioxidant Board and high-quality OSP Antioxidant Board deliver excellent solderability and flatness for lead-free assembly processes. For applications requiring superior corrosion resistance and bondability, the Nickel Gold Plate Series provides a robust finish with excellent contact reliability. The Spray Tin Plate Series offers a cost-effective, lead-free solderable surface suitable for many standard electronic products. In terms of laminate materials, Zhejiang Lingchao manufactures the FR-4 Multilayer Circuit Board, known for its mechanical strength, flame resistance, and stable electrical properties under varying temperatures. Meanwhile, the FR-4, CEM-3 Double-sided Circuit Board combines the performance of FR-4 with the cost advantages of CEM-3 composite material, making it an ideal choice for consumer electronics and household appliances. All these products are supported by advanced in-house equipment such as automatic optical inspection machines, AOI scanners, CNC drilling and milling machines, laser direct imaging exposure lines, VCP automatic electroplating lines, and DES lines. The enterprise adheres to a cultural philosophy of integrity, quality-driven survival, scientific innovation, and pursuit of industry-leading excellence. With cutting-edge processes including lead-free tin spraying, electroless nickel gold, chemical tin deposition, chemical silver deposition, chemical nickel gold deposition, and oxidation resistance (OSP), Zhejiang Lingchao ensures that every Electronic board leaving its facility meets the highest standards of reliability and environmental compliance. The company has received national high-tech and innovation star titles, underscoring its commitment to continuous improvement and customer satisfaction. By integrating superior geographical location in Pingyang Binhai, Wenzhou, with streamlined delivery procedures and a complete process flow, Zhejiang Lingchao Electronic Technology Co., Ltd. delivers integrated, one-stop PCB services to clients worldwide.

Defu Technology (SZ301511), a star stock linked to AI copper foil concept, closed at ¥105.3 per share with a total market capitalization of 66.4 billion yuan. On the evening of May 27, the company issued an announcement that it plans to sign an Investment Project Contract with the Jiujiang Economic and Technological Development Zone Administration Committee.   The company will invest approximately 3.1 billion yuan in total to build a project with an annual output of 50,000 tons of high-end AI electronic circuit copper foil. The project will be undertaken by its wholly-owned subsidiary, Jiujiang Hupo New Materials Co., Ltd. The total investment includes around 2.1 billion yuan in fixed assets and 1 billion yuan of working capital for subsequent operation.   The investment proposal was approved at the 24th meeting of the 3rd Board of Directors held on May 27. Defu Technology reminded investors that the huge capital expenditure will bring certain financial pressure to the company. After the project is completed, the production capacity of high-end AI electronic circuit copper foil will be expanded, which may lead to risks such as oversupply of new capacity, technological iteration and operational management challenges.   Project Location & Construction Plan   The project is situated within the premises of Jiujiang Hupo New Materials Co., Ltd., the company’s wholly-owned subsidiary.   This cooperation does not constitute a related transaction or major asset restructuring. In accordance with relevant regulations, the investment plan still needs to be reviewed and approved at the extraordinary general meeting. The company will convene its First Extraordinary General Meeting of 2026 on June 12 to vote on the proposal.   The project is located at No.188 Gangxing Road, Jiujiang Economic and Technological Development Zone, Jiangxi Province, covering a land area of about 100 mu. It will be constructed in two phases, with each phase designed for an annual output of 25,000 tons of copper foil. The exact location and land area shall be subject to the officially submitted architectural design plans.   Of the total 3.1 billion yuan investment, fixed assets investment (including buildings, structures, supporting facilities, equipment, land cost and initial working capital) totals about 2.1 billion yuan, and another 1 billion yuan will be reserved for operational working capital in the later stage. The final investment amount will be determined by actual expenditure.   The company stated that the capacity expansion aims to meet market and customer demands, accelerate industrial chain upgrading, and further strengthen its market competitiveness in the high-end copper foil sector.   Capital Arrangement & Financial Status   Apart from shareholders' approval, the project also needs to complete government formalities including project filing and environmental impact assessment. Funds will be raised through self-owned capital, bank loans and other financing channels. The large-scale investment is expected to pose financial pressure on the company.   As of the end of the first quarter of 2026, Defu Technology held monetary funds of about 5.373 billion yuan.   Stock Performance & Operating Results   Driven by robust performance and the AI copper foil theme, the stock has been highly favored by market capital. From the intraday low on February 6 to the closing price on May 27, the share price surged by over 270% within 69 trading days (before dividend adjustment), jumping nearly 300% in less than four months.   According to the 2026 Q1 financial report:   Operating revenue: 4.338 billion yuan, a year-on-year increase of 73.47% Net profit attributable to parent company: 147 million yuan, a year-on-year increase of 708.90% Non-recurring profit and loss adjusted net profit: 149 million yuan, a year-on-year increase of 2424.40%   By the end of 2025, the company’s annual production capacity reached 175,000 tons, ranking among the top domestic copper foil manufacturers. In 2025, its electrolytic copper foil output hit 139,600 tons and sales volume reached 140,900 tons, up 50.33% and 51.99% year-on-year respectively.   The company’s main products are divided into lithium battery copper foil and electronic circuit copper foil. In 2025, the revenue of lithium battery copper foil stood at 10.026 billion yuan, a year-on-year increase of 77.61%, accounting for 80.61% of the total operating revenue and becoming its core growth driver.

Zhejiang Lingchao Electronic Technology Co, a professional high-tech manufacturer specializing in the R&D, production and customized processing of automotive electronic circuit boards and PCB products, has officially launched its brand-new Durable Double New Energy Automotive Light Board. Developed exclusively for new energy electric vehicles, hybrid vehicles and modern automotive intelligent lighting systems, this upgraded double-sided automotive light board adopts automotive-grade circuit technology and high-durability structural design. It perfectly adapts to long-term high-temperature, vibration and complex working environments of vehicle lighting systems, effectively solving common problems such as poor heat dissipation, unstable circuit operation and easy aging of traditional automotive light circuit boards, providing reliable core electronic support for automotive headlight, taillight, daytime running light and ambient light modules. The Durable Double New Energy Automotive Light Board features a professional double-sided circuit structure, which realizes high-efficiency circuit integration and uniform heat dissipation, fully meeting the high stability and high safety requirements of new energy vehicle electronic systems. Adopting high-quality flame-retardant substrate and precision electroplating technology, the product delivers excellent electrical conductivity, anti-oxidation performance and thermal stability. It can operate stably in a wide temperature range from -40℃ to 125℃, ensuring consistent brightness and stable signal transmission for automotive LED lighting modules during long-term driving. With strong vibration resistance, corrosion resistance and aging resistance, the light board effectively extends the service life of automotive lighting systems and reduces vehicle maintenance costs. The standardized and precise circuit layout supports mass assembly and customized module matching, suitable for various passenger new energy vehicles and commercial new energy vehicles. With mature PCB manufacturing technology, strict automotive-grade quality inspection standards and rich customized production experience, Zhejiang Lingchao Electronic Technology Co has formed a complete and professional product system focusing on circuit board manufacturing. The company’s core main products cover Single-sided Circuit Board, Double-sided Circuit Board and Multi-layer Circuit Board, covering full-range PCB supporting needs for automotive electronics, intelligent equipment, household appliances and industrial control fields. The company’s single-sided circuit boards feature stable performance, low cost and high cost performance, widely used in conventional electronic equipment and basic circuit modules. The high-precision double-sided circuit boards adopt advanced double-sided conduction and through-hole technology, with higher circuit density and stronger load capacity, which are the core components of automotive electronics and medium-end intelligent equipment. The multi-layer circuit boards support high-density wiring, high voltage resistance and high-speed signal transmission, fully meeting the high-standard requirements of new energy vehicle control systems, intelligent driving modules and precision electronic equipment. All products comply with international industrial and automotive electronic standards, with reliable quality, high precision and strong customization, winning long-term trust and recognition from global customers. The launch of the Durable Double New Energy Automotive Light Board further enriches the company’s automotive-grade double-sided circuit board product line, strengthens its product layout in the new energy vehicle electronic supporting field, and improves the professionalism and market competitiveness of Lingchao Electronic’s PCB series products. In the future, Zhejiang Lingchao Electronic Technology Co will continue to focus on technological innovation and quality upgrading of circuit board products, continuously optimize the performance of automotive-grade PCB products, and provide high-quality single-sided, double-sided and multi-layer circuit board solutions for global new energy automotive electronics and intelligent manufacturing industries.

Currently, the monthly shortage of electronic cloth in major domestic CCL factories has soared to 40-50 million meters; the monthly shortage for a single leading factory reaches 10 million meters; the inventory has remained at a level close to zero since the end of last year - orders are fulfilled and then immediately shipped out, and even some CCL factories have directly stood by the looms, pulling the cloth off the machine as soon as it is produced. The downstream CCL orders have reached 80% of those for June. The industry has maintained 1-2 months' worth of orders for 3-4 consecutive months, far exceeding the normal cycle of 7-10 days. It is expected that in June, the price of 728 electronic cloth will increase by 5 cents per meter, thin cloth by 7-8 cents per meter, and CCL will be uniformly raised by 10%. This is a level of tension that has never been seen in the 20-year history of the industry - in the 2021 round, there was still inventory to absorb, but in this round, there is no inventory at all. More importantly, AI is restructuring the entire CCL material system in an unprecedented way: the demand side has tripled the number of PCB layers, the supply side is monopolized by Toyota alone, and the value center has rapidly shifted from traditional thick cloth to high-end thin cloth priced at 30-40 yuan per meter.   Industrial information. Let's take a look here first. The moonlight decreased by 50 million meters - for the first time in 20 years, there was no even a single piece of inventory left. Currently, the monthly shortage of electronic cloth for large-scale CCL factories in China has reached 40-50 million meters; even a single leading factory has a monthly shortage of 10 million meters. The inventory has remained at a level close to zero since the end of last year - orders are fulfilled and then immediately removed, and even some CCL factories have been standing by at the looms, pulling the cloth off the loom and taking it away immediately. The downstream CCL orders have been scheduled up to 80% for June. The industry has maintained 1-2 months' worth of orders for three to four consecutive months, far exceeding the normal 7-10-day cycle. This is the first time in the 20-year history of the industry - in 2021, that round was somewhat tight, but there was still inventory to absorb; this round is a complete imbalance between supply and demand, and even the inventory buffer has been removed.   AI has tripled the number of PCB layers - the share of traditional 7628 type has dropped from 60% to 40% The PCB layers of AI servers have reached 10 to 30, which is more than three times that of traditional computers or mobile phones (4 to 10 layers). The amount of electronic fabric required for the same chip has increased several times. Even more severely, the supply side - ultra-thin fabrics such as 1080 and 2116 - have been completely consumed by AI demand, squeezing the production capacity of traditional 7628 thick fabrics. The proportion of 7628 in the production of electronic fabrics has dropped from 60% in the past to over 40%. Leading high-end CCL factories have switched to produce high-end products like Ma8 and Ma9, and traditional materials are basically not receiving orders. The next wave of risks is more clear: if the future research direction relaxes the requirements for quartz fabrics and Ma8 and Ma9 switch to use first-generation and second-generation fabrics, traditional fabrics will suffer a second blow.   The loom was completely shut down by Toyota - the production halt will be postponed until the second quarter of 2027. The expansion project is stuck at the narrowest bottleneck - the loom. The supply of looms is basically monopolized by Toyota Automatic Looms, with an annual production capacity of less than 2,000 units and no expansion plans in place; other suppliers like Jin Tianju have a very small market share. The expansion of the CCL process is also hindered by increasingly strict environmental pollution permit approvals. Jieshi's 50,000-ton capacity was ignited in May, but it will take 2-3 months after ignition to actually start producing fabric; the earliest shipment is in June-July, with a monthly increase of only 10 million meters; Jiantao's 70,000-ton capacity will be ignited in July and won't start producing fabric until September. Experts have clearly determined that even if both expansions are fully implemented, there will be no sign of the shortage being alleviated until 2026, and the problem won't be truly resolved until the looms return in the second quarter of 2027.   The unit price of thin fabric ranges from 30 to 40 yuan per meter - the value center is accelerating its upward movement. The unit price of traditional 7628 fabric is less than 10 yuan per meter, and even at its peak in 21 years, it only reached 8.5-9 yuan per meter. However, the unit price of the first and second generation thin fabrics (used in the high-end AI products of Model 8 and Model 9) is 30-40 yuan per meter, which is 5-10 times that of ordinary fabrics. If the demand for AI continues to increase and the requirements for quartz fabric/cob cloth in Model 8 and Model 9 are relaxed to those of the first and second generation fabrics, this gap will become even more exaggerated, with higher unit prices and greater profits. Manufacturers mainly engaged in fabric production have the greatest flexibility - for the same loom, the marginal value of switching to produce the first and second generation fabrics is more than five times that of the ordinary 728 fabric. This is a typical structure where the bottleneck is tightening and the value is rising.   1. This round of shortage of electronic components vs. the round in 2021-202   We are an analysis team that has been deeply engaged in company and industry research for 17 years. Our mission is to teach you to build a systematic analytical ability in an easy-to-understand way, step by step. From financial report interpretation, company analysis, industry analysis, to valuation methods and key issue dissection, the content is comprehensive and practical. At the same time, we will continue to provide in-depth analysis of companies and industries, track industry dynamics, changes and important information in real time, and help you continuously improve your independent thinking and research judgment abilities.

SHENZHEN — As the global automotive industry accelerates its shift toward electrification, the demand for high-reliability electronic components has reached an all-time high. A new standard in New Energy Automotive Light Boards is emerging, designed specifically to meet the rigorous demands of modern electric vehicles (EVs). ? Engineered for the Future of Mobility The latest innovation in this sector is the Durable Double New Energy Automotive Light Board. Unlike traditional circuit boards, these components are engineered to withstand the unique thermal and electrical challenges presented by new energy vehicles. Key features of this advanced FR4 Double Sided Circuit Board include: Superior Thermal Management: Designed to dissipate heat efficiently, ensuring consistent performance for high-intensity LED lighting systems common in EVs. Enhanced Durability: The "Durable Automotive Light Board" designation highlights its resistance to vibration and extreme temperature fluctuations, critical for automotive safety standards. High-Reliability Material: Utilizing high-quality FR4 substrate ensures excellent mechanical strength and electrical insulation properties. ? Meeting the Demands of Smart Lighting Modern New Energy Vehicles rely heavily on complex lighting systems for both safety and aesthetics, including adaptive headlights and intricate interior ambient lighting. The New Energy Car Circuit Board acts as the backbone for these systems. "The transition to double-sided technology allows for more compact and efficient designs," noted a senior engineer in the field. "By maximizing the surface area for circuitry, manufacturers can integrate more functions into smaller spaces without compromising on the durability required for the automotive sector." ? Manufacturing Excellence As seen in recent manufacturing setups, the production of these boards involves precision engineering. The integration of automated assembly and rigorous quality control ensures that every Durable Automotive Light Board meets international safety standards before being installed in vehicles. With the automotive electronics market projected to grow significantly through 2030, the development of robust, double-sided FR4 solutions marks a pivotal step in the evolution of intelligent transportation systems.  

New Perspective on Glass Fiber: Focused on the knowledge and product applications of glass fiber and other composite materials, continuously sharing insights on glass fiber products and the latest industry updates. Stay tuned for our updates and unlock the core knowledge of the glass fiber industry together! Editor: Gao Yong  Supervisor: Yong Ming   Source: Official Enterprise   Today's article will interpret the four core upstream material industry chains of PCB and list the leading enterprises in each track. It is full of practical knowledge. Whether it is industry practitioners, industry chain researchers, or readers who are concerned about industry opportunities, they can all understand the core pattern of the industry at once. Thank you for reading!   PCB, as a key carrier for electronic component interconnection, is widely used in fields such as communication equipment, artificial intelligence servers, new energy, industrial control, and integrated circuit boards. The core lifeline of industry development lies in the upstream raw materials, mainly including four core categories: copper-clad laminates, copper foils, electronic glass fiber cloth, and epoxy resin. It is also a key breakthrough for high-end high-frequency and high-speed PCBs to achieve domestic substitution. With the continuous increase in AI computing power construction and the surge in demand for high-end PCBs, upstream core materials are accelerating technological iteration and capacity expansion. Leading players in various sub sectors are seizing the industry dividend by relying on technological barriers, capacity scale, and customer certification advantages. 1. Copper clad laminate Copper clad laminate is the core substrate of PCB manufacturing and the key link that determines the performance of PCB boards, making it the cornerstone of the PCB industry. The current industry development mainly focuses on three main lines: high-frequency high-speed boards, IC carrier board special substrates, and general FR-4 basic boards. Among them, high-frequency high-speed copper-clad laminates used in AI servers, high-end communication switches, and optical modules have become the focus of industry competition.   As the absolute leader in domestic copper-clad laminates, Shengyi Technology firmly ranks in the second tier of the world. We have achieved technological leadership in the domestic high-frequency and high-speed M8 and M9 series products, deeply binding with leading PCB and AI server manufacturers, and are a core supplier of high-end communication and computing hardware. South Asia New Materials focuses on the high-frequency and high-speed copper-clad laminate track, with complete M-series product certification and a complete product matrix, accurately targeting high prosperity application scenarios such as AI servers and optical modules. Huazheng New Materials focuses on high-end substrates and IC carrier materials, with outstanding technical strength in high-frequency high-speed boards and metal substrates, and has successfully entered the core supply chain of advanced packaging and computing power PCBs. Jin'an Guoji has been deeply cultivating medium thick FR-4 universal copper-clad laminates, consolidating its basic market with its huge production capacity and cost advantages, while steadily extending into high-frequency and high-speed high-end categories, completing product structure upgrades.   2. Copper foil Copper foil is the conductive core of copper-clad laminates and accounts for the highest proportion of raw material costs. It is divided into two categories: PCB electronic circuit copper foil and lithium battery copper foil. AI computing hardware has put forward strict requirements for PCB copper foil with low profile, ultra-thin specifications, high heat resistance, and low dielectric. High end HVLP and RTF series copper foils have become essential in the industry, and high-end copper foils have also become an important track for domestic substitution in the industry chain.   Copper Crown Copper Foil, backed by the complete industrial chain of Tongling Nonferrous, is a leading enterprise in PCB electronic copper foil in China. The HVLP high-end series achieves large-scale production and is deeply bound to top copper-clad laminates and AI supply chain manufacturers. Defu Technology has laid out dual tracks for PCB and lithium-ion copper foil, successfully entering the AI server supply chain with high-end HVLP copper foil, leading the industry in both technology and production capacity. Nord Corporation and Jiayuan Technology, as veteran leaders in lithium battery copper foil, have crossed over and laid out high-end PCB electronic copper foil, relying on their advantages in ultra-thin special copper foil technology to seize the high-end market. In addition, Zhongyi Technology and Yihao New Materials have rapidly emerged in the PCB circuit copper foil field with their dual business layout and integrated production capacity advantages, supplying multiple leading PCB production enterprises.   3. Electronic cloth Electronic grade fiberglass cloth is the core skeleton of copper-clad laminates, mainly providing insulation, structural rigidity, low expansion rate, and low dielectric properties for PCBs. The explosion of AI high-frequency and high-speed PCBs has driven a surge in demand for high-end electronic fabrics with ultra-thin, ultra-thin, low dielectric, and low thermal expansion coefficients, becoming a high growth sub segment of the fiberglass industry.   Honghe Technology is a global leader in ultra-thin and ultra-thin high-end electronic fabric. Low dielectric products are perfectly compatible with AI high-frequency high-speed boards and have been certified by global top computing power manufacturers, with significant positioning advantages. As the absolute leader in the global fiberglass industry, China Jushi has triple advantages in scale, cost, and technology in the fields of electronic yarn and electronic fabric, covering all categories of conventional and high-end low dielectric electronic fabric. Feilihua is deeply involved in quartz electronic fabric and special fiberglass, and its products are suitable for ultra-high frequency copper-clad laminates and advanced packaging scenarios, with outstanding differentiation advantages. Mount Taishan Fiberglass, a subsidiary of International Composites and Sinoma Technology, is a core supplier of electronic glass fiber and continues to provide stable supporting support for the copper clad laminate industry chain.   4. Resin Epoxy resin and special resins are the bonding core of copper-clad laminates, directly determining the dielectric properties, heat resistance, and stability of PCB boards. General purpose PCBs are mainly made of ordinary epoxy resin, while high-end high-frequency and high-speed PCBs rely on PPO, hydrocarbons BMI、 High end resins such as low dielectric special epoxy have long been monopolized by overseas companies, and now the domestic substitution process is accelerating comprehensively.   Hongchang Electronics is a leading enterprise in electronic grade epoxy resin. Forming a dual main business pattern of resin and copper-clad laminate, high-end epoxy products can be adapted to various high-frequency and high-speed copper-clad laminate production. Dongcai Technology has achieved significant breakthroughs in the field of high-frequency and high-speed electronic resins, breaking the monopoly of foreign investment with high-end products such as M9 grade hydrocarbon resins and successfully entering the AI high-end material supply chain. As a well-established enterprise in the synthetic resin industry, Shengquan Group leads in electronic grade PPO, phenolic resin, and special epoxy technology, and is a core resin supplier for domestic copper-clad laminate enterprises. Overall, the wave of AI computing power is reshaping the PCB industry supply chain. The four core materials of upstream copper-clad laminates, copper foils, electronic fabrics, and specialty resins are both bottlenecks and the biggest opportunities for industry development. With the acceleration of domestic substitution of high-end boards, segmented leaders with advantages in technology research and development, customer certification, and production capacity scale will continue to enjoy the high prosperity dividends of the industry and become the core link with the most growth value in the PCB industry chain.     Disclaimer: Warm reminder: This article is a sharing of industry product information and market trends, and the content is for reference only and does not constitute any investment advice. The stock market is volatile and risky, so caution should be exercised when entering the market. If infringement is involved, please contact us for deletion. Within the scope permitted by law, the official account of the new vision of glass fiber has the final right of interpretation.    

May 11, 2026 – Seoul — The global supply chain for semiconductor-grade PCB materials is tightening dramatically as demand for AI servers, high-performance computing (HPC), and advanced packaging skyrockets, triggering a sharp escalation in lead times and a broadening shortage of copper clad laminate (CCL) across all tiers. CCL Lead Times Extend Beyond 6 Weeks as Supply Pressure Mounts Industry sources confirm that delivery cycles for standard double-sided CCL have stretched from the historical 2-week window to up to 6 weeks or longer, signaling rapidly intensifying upstream material constraints. CCL—the foundational substrate for semiconductor boards and PCBs—consists of copper foil bonded to both sides of an insulating core, directly influencing high-speed signal transmission, thermal dissipation, and structural stability. The exponential rise of AI chips, high-speed GPUs, HBM, and advanced packaging has supercharged demand for high-performance CCL. T-Glass Shortage: The Core Bottleneck for High-Grade CCL At the heart of the supply crunch is T-Glass (low-CTE glass fiber), a material with an ultra-low coefficient of thermal expansion that minimizes substrate warpage during high-temperature manufacturing. Long reserved for premium applications like FC-BGA and FC-CSP substrates, T-Glass is now critical for AI server modules and memory boards, driving unprecedented demand. Global supply of high-grade T-Glass remains highly concentrated in Japanese manufacturers, with Nittobo dominating the low-CTE glass fiber market due to decades of technical expertise and qualification by major tech firms. While supply chain diversification efforts are underway with Taiwanese and Chinese mainland suppliers, stringent qualification requirements and long certification cycles delay near-term substitution. Shortage Spreads to Low-End E-Glass CCL A notable shift is the spillover of supply constraints into E-Glass, the standard glass fiber for mid- and low-tier CCL. As CCL producers reallocate limited capacity to high-margin, value-added products for AI applications, output of general-purpose CCL has declined, leading to shortages even in mainstream segments. Industry Response & Outlook Major material suppliers, including Doosan Electronics, are aggressively expanding high-performance CCL capacity to capitalize on booming AI infrastructure and advanced packaging demand. While the industry has not yet entered a full-scale "supply outage" phase—supported by PCB manufacturers’ safety stocks and ongoing capacity expansions—near-term mass production disruptions remain possible. The AI revolution is rapidly reshaping the PCB and CCL landscape, with high-performance material supply capacity emerging as a key competitive differentiator. As demand continues to outpace supply, lead times are expected to remain elevated, and material shortages may persist through 2026, underscoring the need for strategic inventory planning and supply chain resilience across the electronics manufacturing ecosystem.

As the global automotive industry accelerates toward electrification, intelligentization, and lightweighting, new energy vehicles (NEVs) have become the core driving force of market transformation. Automotive lighting—a critical module for safety, styling, and energy efficiency—has evolved rapidly from traditional halogen and HID systems to high‑power LED, matrix LED, and even smart adaptive lighting systems. At the heart of this evolution lies the PCB for new energy vehicle lamp, a specialized circuit board engineered to meet the extreme demands of NEV operating environments while enabling high‑performance, long‑life, and regulation‑compliant lighting functions. This document elaborates on the technical positioning, core advantages, material selection, design principles, manufacturing standards, application scenarios, quality control, and future development trends of automotive lamp PCBs for NEVs, providing a comprehensive reference for OEMs, Tier‑1 suppliers, and engineering teams.

 Seoul, May 9, 2026 — The explosive growth in global AI computing demand is reshaping the electronic materials supply chain profoundly. Recently, two major moves in South Korea have drawn industry attention: Lotte Energy Materials announced a 49 billion KRW investment to expand production capacity of copper foil dedicated to AI applications. Meanwhile, South Korean PCB manufacturers are rushing to lock in CCL inventory, triggering a full-blown shortage alert and intensifying the supply-demand imbalance of high-end electronic materials worldwide. Lotte Energy Materials Invests 49 Billion KRW in Capacity Expansion to Target AI Copper Foil Market On April 28, Lotte Energy Materials, a leading South Korean copper foil enterprise, officially unveiled a large-scale capacity expansion plan. The company will inject 49 billion KRW into its Iksan No.1 factory to upgrade production capacity for AI-specific circuit copper foil, with the construction period running from May 1, 2026 to November 30, 2027. The expansion focuses on HVLP (Very Low Profile) copper foil, the core material for high-performance PCBs used in AI data centers and high-speed network equipment. Upon full completion, the factory’s annual production capacity of AI copper foil will rise to 16,000 tons. The products will primarily cater to material demands for NVIDIA GPUs, high-end servers and other core hardware, while ensuring stable inventory supply for key clients. To strengthen industrial chain collaboration, Lotte Energy Materials is in-depth cooperation with Doosan Electronics BG to jointly advance R&D and mass supply of high-performance PCB copper foil, building an integrated supporting system covering copper foil, CCL and PCB. Kim Yeon-seop, Representative of Lotte Energy Materials, stated: "This investment is a strategic layout to embrace the AI computing revolution. Through technological upgrading of core materials and capacity expansion, we will further improve product quality and global supply stability, consolidate our core competitiveness in the high-end electronic materials sector, and drive sustained business performance growth." CCL Shortage Crisis Erupts; South Korean Manufacturers Lock Supply with 10 Billion KRW Pre-orders Amid accelerated expansion of copper foil capacity, the downstream Copper Clad Laminate (CCL) market has fallen into severe supply-demand imbalance with a worsening shortage alert. A major PCB manufacturer in the Seoul Metropolitan Area recently placed pre-orders worth 10 billion KRW with two top Taiwanese CCL producers, EMC and TUC. The amount is more than five times its normal monthly procurement volume of 1.5 to 2 billion KRW, aiming solely to avoid supply disruption risks. "I have been in the industry for over 20 years, and this is the first time we face production suspension due to CCL shortages," the company CEO admitted. The current raw material supply situation remains severe with prices soaring continuously and delivery times uncertain, spreading panic across the industry. As the core substrate of PCB, CCL is composed of insulating base material bonded with copper foil, serving as the structural framework for electronic manufacturing. Its shortage has spread from individual segments to the entire semiconductor and electronics industrial chain. Prices Hit Record Highs; AI Demand Acts as Core Driving Force According to data released by South Korea Customs Service on May 3, South Korea’s average import price of CCL reached USD 20,728 per ton in March 2026, surging 74.5% year-on-year from USD 11,880, breaking the USD 20,000 threshold for the first time since relevant statistics began in 2000. Export prices also posted a sharp increase, with South Korea’s average CCL export price hitting USD 30,998 per ton last month, a 65.2% year-on-year rise. The skyrocketing prices are primarily driven by booming demand in the AI semiconductor industry. High-spec CCL adopting E-glass fiber substrates is in surging demand for NVIDIA Blackwell series GPUs, high-end AI servers, data center switches and other devices. Meanwhile, rapid development of 5G/6G communication and autonomous driving in-vehicle systems has further widened the supply-demand gap for high-end CCL. Profits and stock prices across the industrial chain have surged simultaneously. As the exclusive supplier of CCL for NVIDIA Blackwell chips, Doosan Group’s share price soared from 152,300 KRW at the end of April 2024 to 1,596,000 KRW by the end of last month, a rise of more than ten times. Over the same period, Samsung Electro-Mechanics saw its stock price jump 5.3 times and Daedong Electronics 4.8 times, reflecting the sustained prosperity transmitted throughout the industry. SMEs Caught in Survival Crisis; Global Supply Chain Restructuring Accelerates Behind the industry boom, structural differentiation has intensified. Within South Korea’s CCL supply chain, upstream copper foil producers including Lotte Energy Materials and SK Nexilis, as well as midstream high-end CCL manufacturers such as Doosan and LG Chem, are prioritizing limited production lines for high-value-added products to supply AI clients. A large number of small and medium-sized PCB enterprises relying on ordinary E-glass fiber based CCL face heightened risks of production suspension due to squeezed production capacity and unstable supply. The supply chain crisis continues to escalate, with some major South Korean semiconductor equipment manufacturers also suffering from CCL shortages. To shorten delivery cycles, enterprises are opting for air freight instead of sea freight, pushing logistics costs sharply higher. Industry insiders revealed: "Previously, orders could be fulfilled within one month; now even immediate orders require at least six months for delivery, marking an all-time high in supply chain uncertainty." Currently, the global electronic materials industrial chain is undergoing profound restructuring. South Korean enterprises are accelerating layout of high-end production capacity; Taiwanese CCL manufacturers hold dominant bargaining power in core supply; mainland Chinese copper foil enterprises such as Jiayuan Technology and Tongguan Copper Foil are rapidly capturing market share with technological breakthroughs in HVLP products. With the sustained release of AI computing demand, the tight supply of CCL and high-end copper foil will persist in the short term. The global supply chain will accelerate restructuring amid market competition, and enterprises with advantages in technology, production capacity and industrial chain collaboration will lead the new round of industry growth cycle.

Recently, Zhejiang Lingchao Electronic Technology Co., LTD., a professional Printed circuit board manufacturer with a history dating back to 1993, has further optimized its product system, focusing on upgrading the quality and performance of its core Electronic board products. As a National High-Tech Enterprise, the company has been committed to the R&D, production and sales of various circuit board products, covering Single sided electronic circuit board, Double sided electronic circuit board and Multi-layer electronic circuit board, which are widely used in automotive, medical, LED lighting and other high-tech fields.   With advanced intelligent production lines and strict quality control systems, the company ensures the stability and precision of each Printed circuit board. The upgraded Single sided electronic circuit board and Double sided electronic circuit board have improved mechanical performance and electrical conductivity, while the Multi-layer electronic circuit board has achieved higher density and better signal integrity, meeting the increasingly strict requirements of global customers. Meanwhile, all Electronic board products adopt lead-free and environmentally friendly processes, complying with international environmental standards.   Adhering to the corporate philosophy of "Integrity-based, Striving for Survival with Quality", Zhejiang Lingchao will continue to focus on technological innovation, optimize its circuit board product portfolio, and provide more reliable and high-quality integrated solutions for customers at home and abroad.  

The NEV industry is undergoing a profound transformation, with lighting systems evolving from basic illumination tools to intelligent, interactive core components that enhance safety, brand identity, and user experience. Traditional automotive light boards often struggle to meet the unique needs of NEVs—including strict energy consumption requirements, space constraints, and the demand for smart functionality. Leveraging years of R&D experience in automotive lighting and deep insights into NEV market trends, the brand has developed the Advanced New Energy Automotive Light Board to bridge this gap, offering a comprehensive solution that aligns with the industry’s shift toward electrification, intelligence, and sustainability. The advanced ultra-thin design is another standout feature, addressing the space constraints of NEV interiors and exteriors. By adopting innovative silicone optical components and eliminating traditional PCB (Printed Circuit Board) structures, the light board achieves a thickness reduction of up to 71% compared to conventional products, with a slim profile of just 0.12 inches thick. This ultra-thin design enables flexible installation in narrow spaces such as front grilles, bumpers, and interior cabins, providing NEV designers with greater creative freedom to craft distinctive lighting signatures and aerodynamic body shapes. Sustainability and durability are integrated into every aspect of the light board’s design. It is crafted from eco-friendly, recyclable materials, including low-VOC (volatile organic compound) finishes and recycled optical components, aligning with global carbon neutrality goals and NEV manufacturers’ ESG (Environmental, Social, and Governance) strategies. The one-piece molding process eliminates seams and gaps, creating a fully sealed structure that offers IP68-level waterproof, dustproof, and corrosion-resistant performance, ensuring long-term reliability in harsh automotive environments—from extreme temperatures (-40℃ to 125℃) to heavy vibrations and chemical exposure. Additionally, the solid structure enhances impact resistance, withstanding collisions and flying debris without compromising functionality. Versatility in application makes the Advanced New Energy Automotive Light Board suitable for a wide range of NEV models, including electric sedans, SUVs, and commercial electric vehicles. It can be customized for both exterior lighting (headlights, taillights, daytime running lights) and interior lighting (ambient lights, dashboard lights), supporting OTA (Over-the-Air) upgrades to add new lighting functions and animations, ensuring long-term adaptability to evolving NEV technology and user preferences. Its transparent and flexible design also allows for 3D and curved lighting configurations, enabling unprecedented visual effects that help NEV brands differentiate their products in a competitive market. The Advanced New Energy Automotive Light Board is now available for bulk purchase by NEV manufacturers, auto parts suppliers, and customization workshops, with exclusive technical support and after-sales service. With its unique combination of intelligent control, ultra-thin design, energy efficiency, and sustainability, this light board is poised to become a core component in next-generation NEVs, driving the evolution of automotive lighting toward smarter, greener, and more innovative solutions.

In the manufacturing of high-layer and multi-layer PCBs, the key lies in the stable mass production of buried and blind via technology. It serves as the core principle of high-end PCB manufacturing, as well as the dividing line between "paper-only technology" and genuine technical strength. On one hand, consumer electronics pursue light weight, thin profile and high-density interconnection, representing the continuous exploration of ultimate miniaturization. On the other hand, products for AI computing power and servers focus on high frequency, high speed, signal transmission, high-layer stacking and buried & blind via technology, which mark the extreme challenges for data transmission capabilities in the computing era. The R&D of high-end products can never be achieved through empty promotion. The decisive factor for enterprises’ competitiveness is how to convert these cutting-edge technologies into tangible products and realize stable mass production.   Why is stable mass production so difficult?  Professionals in the industry are generally familiar with the basic process flow of blind and buried via technology. It is not hard to produce a few prototypes; the real challenge is maintaining consistent stability throughout high-volume production. 1.Drilling accuracy and depth control Blind vias only connect the outer layers with specific inner layers, while buried vias are completely hidden between inner layers. Laser drilling requires extremely precise depth control. Excessive drilling depth will damage the target layer, whereas insufficient depth will result in failed interlayer connection. The hole diameter is usually ≤ 0.15mm, and the hole position deviation must be controlled within ±0.02mm. Any deviation beyond the tolerance will cause misalignment between vias and circuits, sharply increasing the risk of open circuits. 2.Uniformity of electroplated through holes and blind holes Through holes feature a high aspect ratio, which restricts the circulation of electrolyte inside the holes and easily causes uneven plating thickness. For AI server applications, the electroplated copper thickness on the inner walls of buried and blind vias shall be no less than 25μm, with surface copper thickness deviation controlled within ±3μm. Insufficient copper thickness will directly reduce current carrying capacity. 3.Control of layer alignment in multi-layer lamination High-end HDI boards often require multiple lamination cycles for completion. Each lamination process carries the risk of interlayer offset. If the interlayer alignment error exceeds ±25μm, the stability of signal transmission will be compromised.   Second-order HDI boards generally need three times of lamination. With each additional lamination step, the production yield typically drops by approximately 5% to 10%. 4.Differentiated challenges brought by high-frequency and high-speed materials The layer count of HDI boards for AI servers has evolved from the conventional 20 layers to 40 layers, and even 60 to 78 layers. The number of buried and blind vias can exceed 5,000 per square meter. High-frequency and high-speed materials are required, such as M9-grade ultra-low loss materials (Dk＜3.0), to support high-frequency and high-speed signal transmission. From consumer electronics to AI computing power hardware, the technical difficulty has achieved leaping upgrades.   Only stable mass production capability is the absolute truth. 1.Three Core Indicators of Mass Production Capability Yield stability: The mass production yield shall remain steadily above 98% with a fluctuation range of less than 1%. Otherwise, it will lead to out-of-control costs. Delivery consistency: Deviations in hole position accuracy, copper thickness uniformity and electrical performance of products from different batches must be controlled within ±5%. Cost controllability: On the premise of ensuring quality, control the unit cost within the customer’s acceptable range to avoid losing market share due to excessive costs. Maintaining a mass production gross profit margin above 30% represents sound cost control. 2.How to Improve Mass Production Capability Process standardization: Solidify the parameters of each process into standardized operating procedures (SOP) to reduce discrepancies caused by manual operation. Equipment automation: Adopt fully automatic laser drilling machines, electroplating lines and AOI inspection equipment to improve production efficiency and product consistency. Professional talent team: Cultivate interdisciplinary talents with comprehensive capabilities in design, process and quality control to quickly handle unexpected on-site production issues. Supply chain collaboration: Establish in-depth cooperation with material and equipment suppliers to secure high-quality raw materials and equipment in advance, ensuring stable supply. The R&D of high-end products relies not on empty boasting, but on steadily refining every process detail step by step, ultimately transforming cutting-edge technologies into stable mass production that is repeatable, scalable and profitable.     With unwavering commitment to stable mass production and superior quality, our company is a trusted leader in PCB manufacturing. We specialize in a full range of high-performance products, including FPC Flexible Board Series & Soft-Hard Combination Board Series, OSP Antioxidant Board, Nickel Gold Plate Series, Spray Tin Plate Series, FR-4 Multilayer Circuit Board, and FR-4, CEM-3 Double-sided Circuit Board. Backed by mature buried and blind via technology—core to high-layer and multi-layer PCB manufacturing—we translate cutting-edge technical strength into consistent, reliable products. Our strict quality control and standardized production processes ensure each product meets the highest industry standards, delivering stable performance and long-term value for customers across various fields.

Zhejiang Lingchao Electronic Technology is realigning its product mix to capture the PCB industry's rebound. Market Context: Global PCB output fell 15% to $69.5B in 2023 amid destocking, but AI demand is fueling 5% growth in 2024. China maintains 50%+ global share at $37.8B. Long-term trajectory points to $90.4B by 2028. Server market recovery—2.05% growth projected for 2024 after 2023's 6% decline—is driving high-layer board demand. Aspeed revenue trends and Inventec guidance confirm the upturn. Lingchao's strategy: leverage full-range capability while concentrating R&D investment on high-layer multi-layer boards for premium segments.

As the global PCB (Printed circuit board) industry enters a new growth cycle, Zhejiang Lingchao Electronic Technology Co., LTD (Lingchao Electronics), a professional circuit board R&D and production manufacturer, actively adjusts product layout and strengthens technological innovation to seize market opportunities brought by industry recovery. According to circuit layer classification, Printed circuit board includes Single sided electronic circuit board, Double sided electronic circuit board and Multi-layer electronic circuit board. Single sided electronic circuit board, the most basic Electronic board, is used in ordinary household appliances and remote controls; Double sided electronic circuit board is applied in consumer electronics, automotive electronics and industrial control; Multi-layer electronic circuit board (4-6 layers, 8-16 layers, 18+ layers) is suitable for complex scenarios, with high-layer boards used in communication equipment, high-end servers and military fields. Affected by destocking and interest rate hikes, global PCB output value dropped 15% year-on-year to $69.517 billion in 2023 (Prismark data). With inventory adjustment and AI development, the industry will grow 5% year-on-year in 2024. Long-term outlook: 2028 global output value is expected to reach $90.413 billion, with a 5.4% CAGR from 2023 to 2028. China’s PCB industry develops steadily: 2023 mainland output value was $37.794 billion, accounting for over 50% of the global market. The upgrading and demand recovery of general servers further increase the demand for Multi-layer electronic circuit board. The global server market is recovering. 2022 shipments reached 14.17 million units (up 4.7% YoY), while 2023 dropped 6.0% to 13.32 million units. Trendforce predicts 2.05% YoY growth in 2024. Indicators like Aspeed Technology’s revenue and Inventec’s statement confirm the recovery, driving demand for Multi-layer electronic circuit board. Adhering to "technology first, quality-oriented", Lingchao Electronics has a complete product line covering all three types of PCB. It focuses on high-layer Multi-layer electronic circuit board R&D to meet high-end demand, and will optimize product structure to achieve better development in the new growth cycle.