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Defu Technology (SZ301511), a star stock linked to AI copper foil concept, closed at ¥105.3 per share with a total market capitalization of 66.4 billion yuan. On the evening of May 27, the company issued an announcement that it plans to sign an Investment Project Contract with the Jiujiang Economic and Technological Development Zone Administration Committee.   The company will invest approximately 3.1 billion yuan in total to build a project with an annual output of 50,000 tons of high-end AI electronic circuit copper foil. The project will be undertaken by its wholly-owned subsidiary, Jiujiang Hupo New Materials Co., Ltd. The total investment includes around 2.1 billion yuan in fixed assets and 1 billion yuan of working capital for subsequent operation.   The investment proposal was approved at the 24th meeting of the 3rd Board of Directors held on May 27. Defu Technology reminded investors that the huge capital expenditure will bring certain financial pressure to the company. After the project is completed, the production capacity of high-end AI electronic circuit copper foil will be expanded, which may lead to risks such as oversupply of new capacity, technological iteration and operational management challenges.   Project Location & Construction Plan   The project is situated within the premises of Jiujiang Hupo New Materials Co., Ltd., the company’s wholly-owned subsidiary.   This cooperation does not constitute a related transaction or major asset restructuring. In accordance with relevant regulations, the investment plan still needs to be reviewed and approved at the extraordinary general meeting. The company will convene its First Extraordinary General Meeting of 2026 on June 12 to vote on the proposal.   The project is located at No.188 Gangxing Road, Jiujiang Economic and Technological Development Zone, Jiangxi Province, covering a land area of about 100 mu. It will be constructed in two phases, with each phase designed for an annual output of 25,000 tons of copper foil. The exact location and land area shall be subject to the officially submitted architectural design plans.   Of the total 3.1 billion yuan investment, fixed assets investment (including buildings, structures, supporting facilities, equipment, land cost and initial working capital) totals about 2.1 billion yuan, and another 1 billion yuan will be reserved for operational working capital in the later stage. The final investment amount will be determined by actual expenditure.   The company stated that the capacity expansion aims to meet market and customer demands, accelerate industrial chain upgrading, and further strengthen its market competitiveness in the high-end copper foil sector.   Capital Arrangement & Financial Status   Apart from shareholders' approval, the project also needs to complete government formalities including project filing and environmental impact assessment. Funds will be raised through self-owned capital, bank loans and other financing channels. The large-scale investment is expected to pose financial pressure on the company.   As of the end of the first quarter of 2026, Defu Technology held monetary funds of about 5.373 billion yuan.   Stock Performance & Operating Results   Driven by robust performance and the AI copper foil theme, the stock has been highly favored by market capital. From the intraday low on February 6 to the closing price on May 27, the share price surged by over 270% within 69 trading days (before dividend adjustment), jumping nearly 300% in less than four months.   According to the 2026 Q1 financial report:   Operating revenue: 4.338 billion yuan, a year-on-year increase of 73.47% Net profit attributable to parent company: 147 million yuan, a year-on-year increase of 708.90% Non-recurring profit and loss adjusted net profit: 149 million yuan, a year-on-year increase of 2424.40%   By the end of 2025, the company’s annual production capacity reached 175,000 tons, ranking among the top domestic copper foil manufacturers. In 2025, its electrolytic copper foil output hit 139,600 tons and sales volume reached 140,900 tons, up 50.33% and 51.99% year-on-year respectively.   The company’s main products are divided into lithium battery copper foil and electronic circuit copper foil. In 2025, the revenue of lithium battery copper foil stood at 10.026 billion yuan, a year-on-year increase of 77.61%, accounting for 80.61% of the total operating revenue and becoming its core growth driver.

Zhejiang Lingchao Electronic Technology Co, a professional high-tech manufacturer specializing in the R&D, production and customized processing of automotive electronic circuit boards and PCB products, has officially launched its brand-new Durable Double New Energy Automotive Light Board. Developed exclusively for new energy electric vehicles, hybrid vehicles and modern automotive intelligent lighting systems, this upgraded double-sided automotive light board adopts automotive-grade circuit technology and high-durability structural design. It perfectly adapts to long-term high-temperature, vibration and complex working environments of vehicle lighting systems, effectively solving common problems such as poor heat dissipation, unstable circuit operation and easy aging of traditional automotive light circuit boards, providing reliable core electronic support for automotive headlight, taillight, daytime running light and ambient light modules. The Durable Double New Energy Automotive Light Board features a professional double-sided circuit structure, which realizes high-efficiency circuit integration and uniform heat dissipation, fully meeting the high stability and high safety requirements of new energy vehicle electronic systems. Adopting high-quality flame-retardant substrate and precision electroplating technology, the product delivers excellent electrical conductivity, anti-oxidation performance and thermal stability. It can operate stably in a wide temperature range from -40℃ to 125℃, ensuring consistent brightness and stable signal transmission for automotive LED lighting modules during long-term driving. With strong vibration resistance, corrosion resistance and aging resistance, the light board effectively extends the service life of automotive lighting systems and reduces vehicle maintenance costs. The standardized and precise circuit layout supports mass assembly and customized module matching, suitable for various passenger new energy vehicles and commercial new energy vehicles. With mature PCB manufacturing technology, strict automotive-grade quality inspection standards and rich customized production experience, Zhejiang Lingchao Electronic Technology Co has formed a complete and professional product system focusing on circuit board manufacturing. The company’s core main products cover Single-sided Circuit Board, Double-sided Circuit Board and Multi-layer Circuit Board, covering full-range PCB supporting needs for automotive electronics, intelligent equipment, household appliances and industrial control fields. The company’s single-sided circuit boards feature stable performance, low cost and high cost performance, widely used in conventional electronic equipment and basic circuit modules. The high-precision double-sided circuit boards adopt advanced double-sided conduction and through-hole technology, with higher circuit density and stronger load capacity, which are the core components of automotive electronics and medium-end intelligent equipment. The multi-layer circuit boards support high-density wiring, high voltage resistance and high-speed signal transmission, fully meeting the high-standard requirements of new energy vehicle control systems, intelligent driving modules and precision electronic equipment. All products comply with international industrial and automotive electronic standards, with reliable quality, high precision and strong customization, winning long-term trust and recognition from global customers. The launch of the Durable Double New Energy Automotive Light Board further enriches the company’s automotive-grade double-sided circuit board product line, strengthens its product layout in the new energy vehicle electronic supporting field, and improves the professionalism and market competitiveness of Lingchao Electronic’s PCB series products. In the future, Zhejiang Lingchao Electronic Technology Co will continue to focus on technological innovation and quality upgrading of circuit board products, continuously optimize the performance of automotive-grade PCB products, and provide high-quality single-sided, double-sided and multi-layer circuit board solutions for global new energy automotive electronics and intelligent manufacturing industries.

Currently, the monthly shortage of electronic cloth in major domestic CCL factories has soared to 40-50 million meters; the monthly shortage for a single leading factory reaches 10 million meters; the inventory has remained at a level close to zero since the end of last year - orders are fulfilled and then immediately shipped out, and even some CCL factories have directly stood by the looms, pulling the cloth off the machine as soon as it is produced. The downstream CCL orders have reached 80% of those for June. The industry has maintained 1-2 months' worth of orders for 3-4 consecutive months, far exceeding the normal cycle of 7-10 days. It is expected that in June, the price of 728 electronic cloth will increase by 5 cents per meter, thin cloth by 7-8 cents per meter, and CCL will be uniformly raised by 10%. This is a level of tension that has never been seen in the 20-year history of the industry - in the 2021 round, there was still inventory to absorb, but in this round, there is no inventory at all. More importantly, AI is restructuring the entire CCL material system in an unprecedented way: the demand side has tripled the number of PCB layers, the supply side is monopolized by Toyota alone, and the value center has rapidly shifted from traditional thick cloth to high-end thin cloth priced at 30-40 yuan per meter.   Industrial information. Let's take a look here first. The moonlight decreased by 50 million meters - for the first time in 20 years, there was no even a single piece of inventory left. Currently, the monthly shortage of electronic cloth for large-scale CCL factories in China has reached 40-50 million meters; even a single leading factory has a monthly shortage of 10 million meters. The inventory has remained at a level close to zero since the end of last year - orders are fulfilled and then immediately removed, and even some CCL factories have been standing by at the looms, pulling the cloth off the loom and taking it away immediately. The downstream CCL orders have been scheduled up to 80% for June. The industry has maintained 1-2 months' worth of orders for three to four consecutive months, far exceeding the normal 7-10-day cycle. This is the first time in the 20-year history of the industry - in 2021, that round was somewhat tight, but there was still inventory to absorb; this round is a complete imbalance between supply and demand, and even the inventory buffer has been removed.   AI has tripled the number of PCB layers - the share of traditional 7628 type has dropped from 60% to 40% The PCB layers of AI servers have reached 10 to 30, which is more than three times that of traditional computers or mobile phones (4 to 10 layers). The amount of electronic fabric required for the same chip has increased several times. Even more severely, the supply side - ultra-thin fabrics such as 1080 and 2116 - have been completely consumed by AI demand, squeezing the production capacity of traditional 7628 thick fabrics. The proportion of 7628 in the production of electronic fabrics has dropped from 60% in the past to over 40%. Leading high-end CCL factories have switched to produce high-end products like Ma8 and Ma9, and traditional materials are basically not receiving orders. The next wave of risks is more clear: if the future research direction relaxes the requirements for quartz fabrics and Ma8 and Ma9 switch to use first-generation and second-generation fabrics, traditional fabrics will suffer a second blow.   The loom was completely shut down by Toyota - the production halt will be postponed until the second quarter of 2027. The expansion project is stuck at the narrowest bottleneck - the loom. The supply of looms is basically monopolized by Toyota Automatic Looms, with an annual production capacity of less than 2,000 units and no expansion plans in place; other suppliers like Jin Tianju have a very small market share. The expansion of the CCL process is also hindered by increasingly strict environmental pollution permit approvals. Jieshi's 50,000-ton capacity was ignited in May, but it will take 2-3 months after ignition to actually start producing fabric; the earliest shipment is in June-July, with a monthly increase of only 10 million meters; Jiantao's 70,000-ton capacity will be ignited in July and won't start producing fabric until September. Experts have clearly determined that even if both expansions are fully implemented, there will be no sign of the shortage being alleviated until 2026, and the problem won't be truly resolved until the looms return in the second quarter of 2027.   The unit price of thin fabric ranges from 30 to 40 yuan per meter - the value center is accelerating its upward movement. The unit price of traditional 7628 fabric is less than 10 yuan per meter, and even at its peak in 21 years, it only reached 8.5-9 yuan per meter. However, the unit price of the first and second generation thin fabrics (used in the high-end AI products of Model 8 and Model 9) is 30-40 yuan per meter, which is 5-10 times that of ordinary fabrics. If the demand for AI continues to increase and the requirements for quartz fabric/cob cloth in Model 8 and Model 9 are relaxed to those of the first and second generation fabrics, this gap will become even more exaggerated, with higher unit prices and greater profits. Manufacturers mainly engaged in fabric production have the greatest flexibility - for the same loom, the marginal value of switching to produce the first and second generation fabrics is more than five times that of the ordinary 728 fabric. This is a typical structure where the bottleneck is tightening and the value is rising.   1. This round of shortage of electronic components vs. the round in 2021-202   We are an analysis team that has been deeply engaged in company and industry research for 17 years. Our mission is to teach you to build a systematic analytical ability in an easy-to-understand way, step by step. From financial report interpretation, company analysis, industry analysis, to valuation methods and key issue dissection, the content is comprehensive and practical. At the same time, we will continue to provide in-depth analysis of companies and industries, track industry dynamics, changes and important information in real time, and help you continuously improve your independent thinking and research judgment abilities.

SHENZHEN — As the global automotive industry accelerates its shift toward electrification, the demand for high-reliability electronic components has reached an all-time high. A new standard in New Energy Automotive Light Boards is emerging, designed specifically to meet the rigorous demands of modern electric vehicles (EVs). ? Engineered for the Future of Mobility The latest innovation in this sector is the Durable Double New Energy Automotive Light Board. Unlike traditional circuit boards, these components are engineered to withstand the unique thermal and electrical challenges presented by new energy vehicles. Key features of this advanced FR4 Double Sided Circuit Board include: Superior Thermal Management: Designed to dissipate heat efficiently, ensuring consistent performance for high-intensity LED lighting systems common in EVs. Enhanced Durability: The "Durable Automotive Light Board" designation highlights its resistance to vibration and extreme temperature fluctuations, critical for automotive safety standards. High-Reliability Material: Utilizing high-quality FR4 substrate ensures excellent mechanical strength and electrical insulation properties. ? Meeting the Demands of Smart Lighting Modern New Energy Vehicles rely heavily on complex lighting systems for both safety and aesthetics, including adaptive headlights and intricate interior ambient lighting. The New Energy Car Circuit Board acts as the backbone for these systems. "The transition to double-sided technology allows for more compact and efficient designs," noted a senior engineer in the field. "By maximizing the surface area for circuitry, manufacturers can integrate more functions into smaller spaces without compromising on the durability required for the automotive sector." ? Manufacturing Excellence As seen in recent manufacturing setups, the production of these boards involves precision engineering. The integration of automated assembly and rigorous quality control ensures that every Durable Automotive Light Board meets international safety standards before being installed in vehicles. With the automotive electronics market projected to grow significantly through 2030, the development of robust, double-sided FR4 solutions marks a pivotal step in the evolution of intelligent transportation systems.  

New Perspective on Glass Fiber: Focused on the knowledge and product applications of glass fiber and other composite materials, continuously sharing insights on glass fiber products and the latest industry updates. Stay tuned for our updates and unlock the core knowledge of the glass fiber industry together! Editor: Gao Yong  Supervisor: Yong Ming   Source: Official Enterprise   Today's article will interpret the four core upstream material industry chains of PCB and list the leading enterprises in each track. It is full of practical knowledge. Whether it is industry practitioners, industry chain researchers, or readers who are concerned about industry opportunities, they can all understand the core pattern of the industry at once. Thank you for reading!   PCB, as a key carrier for electronic component interconnection, is widely used in fields such as communication equipment, artificial intelligence servers, new energy, industrial control, and integrated circuit boards. The core lifeline of industry development lies in the upstream raw materials, mainly including four core categories: copper-clad laminates, copper foils, electronic glass fiber cloth, and epoxy resin. It is also a key breakthrough for high-end high-frequency and high-speed PCBs to achieve domestic substitution. With the continuous increase in AI computing power construction and the surge in demand for high-end PCBs, upstream core materials are accelerating technological iteration and capacity expansion. Leading players in various sub sectors are seizing the industry dividend by relying on technological barriers, capacity scale, and customer certification advantages. 1. Copper clad laminate Copper clad laminate is the core substrate of PCB manufacturing and the key link that determines the performance of PCB boards, making it the cornerstone of the PCB industry. The current industry development mainly focuses on three main lines: high-frequency high-speed boards, IC carrier board special substrates, and general FR-4 basic boards. Among them, high-frequency high-speed copper-clad laminates used in AI servers, high-end communication switches, and optical modules have become the focus of industry competition.   As the absolute leader in domestic copper-clad laminates, Shengyi Technology firmly ranks in the second tier of the world. We have achieved technological leadership in the domestic high-frequency and high-speed M8 and M9 series products, deeply binding with leading PCB and AI server manufacturers, and are a core supplier of high-end communication and computing hardware. South Asia New Materials focuses on the high-frequency and high-speed copper-clad laminate track, with complete M-series product certification and a complete product matrix, accurately targeting high prosperity application scenarios such as AI servers and optical modules. Huazheng New Materials focuses on high-end substrates and IC carrier materials, with outstanding technical strength in high-frequency high-speed boards and metal substrates, and has successfully entered the core supply chain of advanced packaging and computing power PCBs. Jin'an Guoji has been deeply cultivating medium thick FR-4 universal copper-clad laminates, consolidating its basic market with its huge production capacity and cost advantages, while steadily extending into high-frequency and high-speed high-end categories, completing product structure upgrades.   2. Copper foil Copper foil is the conductive core of copper-clad laminates and accounts for the highest proportion of raw material costs. It is divided into two categories: PCB electronic circuit copper foil and lithium battery copper foil. AI computing hardware has put forward strict requirements for PCB copper foil with low profile, ultra-thin specifications, high heat resistance, and low dielectric. High end HVLP and RTF series copper foils have become essential in the industry, and high-end copper foils have also become an important track for domestic substitution in the industry chain.   Copper Crown Copper Foil, backed by the complete industrial chain of Tongling Nonferrous, is a leading enterprise in PCB electronic copper foil in China. The HVLP high-end series achieves large-scale production and is deeply bound to top copper-clad laminates and AI supply chain manufacturers. Defu Technology has laid out dual tracks for PCB and lithium-ion copper foil, successfully entering the AI server supply chain with high-end HVLP copper foil, leading the industry in both technology and production capacity. Nord Corporation and Jiayuan Technology, as veteran leaders in lithium battery copper foil, have crossed over and laid out high-end PCB electronic copper foil, relying on their advantages in ultra-thin special copper foil technology to seize the high-end market. In addition, Zhongyi Technology and Yihao New Materials have rapidly emerged in the PCB circuit copper foil field with their dual business layout and integrated production capacity advantages, supplying multiple leading PCB production enterprises.   3. Electronic cloth Electronic grade fiberglass cloth is the core skeleton of copper-clad laminates, mainly providing insulation, structural rigidity, low expansion rate, and low dielectric properties for PCBs. The explosion of AI high-frequency and high-speed PCBs has driven a surge in demand for high-end electronic fabrics with ultra-thin, ultra-thin, low dielectric, and low thermal expansion coefficients, becoming a high growth sub segment of the fiberglass industry.   Honghe Technology is a global leader in ultra-thin and ultra-thin high-end electronic fabric. Low dielectric products are perfectly compatible with AI high-frequency high-speed boards and have been certified by global top computing power manufacturers, with significant positioning advantages. As the absolute leader in the global fiberglass industry, China Jushi has triple advantages in scale, cost, and technology in the fields of electronic yarn and electronic fabric, covering all categories of conventional and high-end low dielectric electronic fabric. Feilihua is deeply involved in quartz electronic fabric and special fiberglass, and its products are suitable for ultra-high frequency copper-clad laminates and advanced packaging scenarios, with outstanding differentiation advantages. Mount Taishan Fiberglass, a subsidiary of International Composites and Sinoma Technology, is a core supplier of electronic glass fiber and continues to provide stable supporting support for the copper clad laminate industry chain.   4. Resin Epoxy resin and special resins are the bonding core of copper-clad laminates, directly determining the dielectric properties, heat resistance, and stability of PCB boards. General purpose PCBs are mainly made of ordinary epoxy resin, while high-end high-frequency and high-speed PCBs rely on PPO, hydrocarbons BMI、 High end resins such as low dielectric special epoxy have long been monopolized by overseas companies, and now the domestic substitution process is accelerating comprehensively.   Hongchang Electronics is a leading enterprise in electronic grade epoxy resin. Forming a dual main business pattern of resin and copper-clad laminate, high-end epoxy products can be adapted to various high-frequency and high-speed copper-clad laminate production. Dongcai Technology has achieved significant breakthroughs in the field of high-frequency and high-speed electronic resins, breaking the monopoly of foreign investment with high-end products such as M9 grade hydrocarbon resins and successfully entering the AI high-end material supply chain. As a well-established enterprise in the synthetic resin industry, Shengquan Group leads in electronic grade PPO, phenolic resin, and special epoxy technology, and is a core resin supplier for domestic copper-clad laminate enterprises. Overall, the wave of AI computing power is reshaping the PCB industry supply chain. The four core materials of upstream copper-clad laminates, copper foils, electronic fabrics, and specialty resins are both bottlenecks and the biggest opportunities for industry development. With the acceleration of domestic substitution of high-end boards, segmented leaders with advantages in technology research and development, customer certification, and production capacity scale will continue to enjoy the high prosperity dividends of the industry and become the core link with the most growth value in the PCB industry chain.     Disclaimer: Warm reminder: This article is a sharing of industry product information and market trends, and the content is for reference only and does not constitute any investment advice. The stock market is volatile and risky, so caution should be exercised when entering the market. If infringement is involved, please contact us for deletion. Within the scope permitted by law, the official account of the new vision of glass fiber has the final right of interpretation.    

May 11, 2026 – Seoul — The global supply chain for semiconductor-grade PCB materials is tightening dramatically as demand for AI servers, high-performance computing (HPC), and advanced packaging skyrockets, triggering a sharp escalation in lead times and a broadening shortage of copper clad laminate (CCL) across all tiers. CCL Lead Times Extend Beyond 6 Weeks as Supply Pressure Mounts Industry sources confirm that delivery cycles for standard double-sided CCL have stretched from the historical 2-week window to up to 6 weeks or longer, signaling rapidly intensifying upstream material constraints. CCL—the foundational substrate for semiconductor boards and PCBs—consists of copper foil bonded to both sides of an insulating core, directly influencing high-speed signal transmission, thermal dissipation, and structural stability. The exponential rise of AI chips, high-speed GPUs, HBM, and advanced packaging has supercharged demand for high-performance CCL. T-Glass Shortage: The Core Bottleneck for High-Grade CCL At the heart of the supply crunch is T-Glass (low-CTE glass fiber), a material with an ultra-low coefficient of thermal expansion that minimizes substrate warpage during high-temperature manufacturing. Long reserved for premium applications like FC-BGA and FC-CSP substrates, T-Glass is now critical for AI server modules and memory boards, driving unprecedented demand. Global supply of high-grade T-Glass remains highly concentrated in Japanese manufacturers, with Nittobo dominating the low-CTE glass fiber market due to decades of technical expertise and qualification by major tech firms. While supply chain diversification efforts are underway with Taiwanese and Chinese mainland suppliers, stringent qualification requirements and long certification cycles delay near-term substitution. Shortage Spreads to Low-End E-Glass CCL A notable shift is the spillover of supply constraints into E-Glass, the standard glass fiber for mid- and low-tier CCL. As CCL producers reallocate limited capacity to high-margin, value-added products for AI applications, output of general-purpose CCL has declined, leading to shortages even in mainstream segments. Industry Response & Outlook Major material suppliers, including Doosan Electronics, are aggressively expanding high-performance CCL capacity to capitalize on booming AI infrastructure and advanced packaging demand. While the industry has not yet entered a full-scale "supply outage" phase—supported by PCB manufacturers’ safety stocks and ongoing capacity expansions—near-term mass production disruptions remain possible. The AI revolution is rapidly reshaping the PCB and CCL landscape, with high-performance material supply capacity emerging as a key competitive differentiator. As demand continues to outpace supply, lead times are expected to remain elevated, and material shortages may persist through 2026, underscoring the need for strategic inventory planning and supply chain resilience across the electronics manufacturing ecosystem.

As the global automotive industry accelerates toward electrification, intelligentization, and lightweighting, new energy vehicles (NEVs) have become the core driving force of market transformation. Automotive lighting—a critical module for safety, styling, and energy efficiency—has evolved rapidly from traditional halogen and HID systems to high‑power LED, matrix LED, and even smart adaptive lighting systems. At the heart of this evolution lies the PCB for new energy vehicle lamp, a specialized circuit board engineered to meet the extreme demands of NEV operating environments while enabling high‑performance, long‑life, and regulation‑compliant lighting functions. This document elaborates on the technical positioning, core advantages, material selection, design principles, manufacturing standards, application scenarios, quality control, and future development trends of automotive lamp PCBs for NEVs, providing a comprehensive reference for OEMs, Tier‑1 suppliers, and engineering teams.

 Seoul, May 9, 2026 — The explosive growth in global AI computing demand is reshaping the electronic materials supply chain profoundly. Recently, two major moves in South Korea have drawn industry attention: Lotte Energy Materials announced a 49 billion KRW investment to expand production capacity of copper foil dedicated to AI applications. Meanwhile, South Korean PCB manufacturers are rushing to lock in CCL inventory, triggering a full-blown shortage alert and intensifying the supply-demand imbalance of high-end electronic materials worldwide. Lotte Energy Materials Invests 49 Billion KRW in Capacity Expansion to Target AI Copper Foil Market On April 28, Lotte Energy Materials, a leading South Korean copper foil enterprise, officially unveiled a large-scale capacity expansion plan. The company will inject 49 billion KRW into its Iksan No.1 factory to upgrade production capacity for AI-specific circuit copper foil, with the construction period running from May 1, 2026 to November 30, 2027. The expansion focuses on HVLP (Very Low Profile) copper foil, the core material for high-performance PCBs used in AI data centers and high-speed network equipment. Upon full completion, the factory’s annual production capacity of AI copper foil will rise to 16,000 tons. The products will primarily cater to material demands for NVIDIA GPUs, high-end servers and other core hardware, while ensuring stable inventory supply for key clients. To strengthen industrial chain collaboration, Lotte Energy Materials is in-depth cooperation with Doosan Electronics BG to jointly advance R&D and mass supply of high-performance PCB copper foil, building an integrated supporting system covering copper foil, CCL and PCB. Kim Yeon-seop, Representative of Lotte Energy Materials, stated: "This investment is a strategic layout to embrace the AI computing revolution. Through technological upgrading of core materials and capacity expansion, we will further improve product quality and global supply stability, consolidate our core competitiveness in the high-end electronic materials sector, and drive sustained business performance growth." CCL Shortage Crisis Erupts; South Korean Manufacturers Lock Supply with 10 Billion KRW Pre-orders Amid accelerated expansion of copper foil capacity, the downstream Copper Clad Laminate (CCL) market has fallen into severe supply-demand imbalance with a worsening shortage alert. A major PCB manufacturer in the Seoul Metropolitan Area recently placed pre-orders worth 10 billion KRW with two top Taiwanese CCL producers, EMC and TUC. The amount is more than five times its normal monthly procurement volume of 1.5 to 2 billion KRW, aiming solely to avoid supply disruption risks. "I have been in the industry for over 20 years, and this is the first time we face production suspension due to CCL shortages," the company CEO admitted. The current raw material supply situation remains severe with prices soaring continuously and delivery times uncertain, spreading panic across the industry. As the core substrate of PCB, CCL is composed of insulating base material bonded with copper foil, serving as the structural framework for electronic manufacturing. Its shortage has spread from individual segments to the entire semiconductor and electronics industrial chain. Prices Hit Record Highs; AI Demand Acts as Core Driving Force According to data released by South Korea Customs Service on May 3, South Korea’s average import price of CCL reached USD 20,728 per ton in March 2026, surging 74.5% year-on-year from USD 11,880, breaking the USD 20,000 threshold for the first time since relevant statistics began in 2000. Export prices also posted a sharp increase, with South Korea’s average CCL export price hitting USD 30,998 per ton last month, a 65.2% year-on-year rise. The skyrocketing prices are primarily driven by booming demand in the AI semiconductor industry. High-spec CCL adopting E-glass fiber substrates is in surging demand for NVIDIA Blackwell series GPUs, high-end AI servers, data center switches and other devices. Meanwhile, rapid development of 5G/6G communication and autonomous driving in-vehicle systems has further widened the supply-demand gap for high-end CCL. Profits and stock prices across the industrial chain have surged simultaneously. As the exclusive supplier of CCL for NVIDIA Blackwell chips, Doosan Group’s share price soared from 152,300 KRW at the end of April 2024 to 1,596,000 KRW by the end of last month, a rise of more than ten times. Over the same period, Samsung Electro-Mechanics saw its stock price jump 5.3 times and Daedong Electronics 4.8 times, reflecting the sustained prosperity transmitted throughout the industry. SMEs Caught in Survival Crisis; Global Supply Chain Restructuring Accelerates Behind the industry boom, structural differentiation has intensified. Within South Korea’s CCL supply chain, upstream copper foil producers including Lotte Energy Materials and SK Nexilis, as well as midstream high-end CCL manufacturers such as Doosan and LG Chem, are prioritizing limited production lines for high-value-added products to supply AI clients. A large number of small and medium-sized PCB enterprises relying on ordinary E-glass fiber based CCL face heightened risks of production suspension due to squeezed production capacity and unstable supply. The supply chain crisis continues to escalate, with some major South Korean semiconductor equipment manufacturers also suffering from CCL shortages. To shorten delivery cycles, enterprises are opting for air freight instead of sea freight, pushing logistics costs sharply higher. Industry insiders revealed: "Previously, orders could be fulfilled within one month; now even immediate orders require at least six months for delivery, marking an all-time high in supply chain uncertainty." Currently, the global electronic materials industrial chain is undergoing profound restructuring. South Korean enterprises are accelerating layout of high-end production capacity; Taiwanese CCL manufacturers hold dominant bargaining power in core supply; mainland Chinese copper foil enterprises such as Jiayuan Technology and Tongguan Copper Foil are rapidly capturing market share with technological breakthroughs in HVLP products. With the sustained release of AI computing demand, the tight supply of CCL and high-end copper foil will persist in the short term. The global supply chain will accelerate restructuring amid market competition, and enterprises with advantages in technology, production capacity and industrial chain collaboration will lead the new round of industry growth cycle.

Recently, Zhejiang Lingchao Electronic Technology Co., LTD., a professional Printed circuit board manufacturer with a history dating back to 1993, has further optimized its product system, focusing on upgrading the quality and performance of its core Electronic board products. As a National High-Tech Enterprise, the company has been committed to the R&D, production and sales of various circuit board products, covering Single sided electronic circuit board, Double sided electronic circuit board and Multi-layer electronic circuit board, which are widely used in automotive, medical, LED lighting and other high-tech fields.   With advanced intelligent production lines and strict quality control systems, the company ensures the stability and precision of each Printed circuit board. The upgraded Single sided electronic circuit board and Double sided electronic circuit board have improved mechanical performance and electrical conductivity, while the Multi-layer electronic circuit board has achieved higher density and better signal integrity, meeting the increasingly strict requirements of global customers. Meanwhile, all Electronic board products adopt lead-free and environmentally friendly processes, complying with international environmental standards.   Adhering to the corporate philosophy of "Integrity-based, Striving for Survival with Quality", Zhejiang Lingchao will continue to focus on technological innovation, optimize its circuit board product portfolio, and provide more reliable and high-quality integrated solutions for customers at home and abroad.  

The NEV industry is undergoing a profound transformation, with lighting systems evolving from basic illumination tools to intelligent, interactive core components that enhance safety, brand identity, and user experience. Traditional automotive light boards often struggle to meet the unique needs of NEVs—including strict energy consumption requirements, space constraints, and the demand for smart functionality. Leveraging years of R&D experience in automotive lighting and deep insights into NEV market trends, the brand has developed the Advanced New Energy Automotive Light Board to bridge this gap, offering a comprehensive solution that aligns with the industry’s shift toward electrification, intelligence, and sustainability. The advanced ultra-thin design is another standout feature, addressing the space constraints of NEV interiors and exteriors. By adopting innovative silicone optical components and eliminating traditional PCB (Printed Circuit Board) structures, the light board achieves a thickness reduction of up to 71% compared to conventional products, with a slim profile of just 0.12 inches thick. This ultra-thin design enables flexible installation in narrow spaces such as front grilles, bumpers, and interior cabins, providing NEV designers with greater creative freedom to craft distinctive lighting signatures and aerodynamic body shapes. Sustainability and durability are integrated into every aspect of the light board’s design. It is crafted from eco-friendly, recyclable materials, including low-VOC (volatile organic compound) finishes and recycled optical components, aligning with global carbon neutrality goals and NEV manufacturers’ ESG (Environmental, Social, and Governance) strategies. The one-piece molding process eliminates seams and gaps, creating a fully sealed structure that offers IP68-level waterproof, dustproof, and corrosion-resistant performance, ensuring long-term reliability in harsh automotive environments—from extreme temperatures (-40℃ to 125℃) to heavy vibrations and chemical exposure. Additionally, the solid structure enhances impact resistance, withstanding collisions and flying debris without compromising functionality. Versatility in application makes the Advanced New Energy Automotive Light Board suitable for a wide range of NEV models, including electric sedans, SUVs, and commercial electric vehicles. It can be customized for both exterior lighting (headlights, taillights, daytime running lights) and interior lighting (ambient lights, dashboard lights), supporting OTA (Over-the-Air) upgrades to add new lighting functions and animations, ensuring long-term adaptability to evolving NEV technology and user preferences. Its transparent and flexible design also allows for 3D and curved lighting configurations, enabling unprecedented visual effects that help NEV brands differentiate their products in a competitive market. The Advanced New Energy Automotive Light Board is now available for bulk purchase by NEV manufacturers, auto parts suppliers, and customization workshops, with exclusive technical support and after-sales service. With its unique combination of intelligent control, ultra-thin design, energy efficiency, and sustainability, this light board is poised to become a core component in next-generation NEVs, driving the evolution of automotive lighting toward smarter, greener, and more innovative solutions.

In the manufacturing of high-layer and multi-layer PCBs, the key lies in the stable mass production of buried and blind via technology. It serves as the core principle of high-end PCB manufacturing, as well as the dividing line between "paper-only technology" and genuine technical strength. On one hand, consumer electronics pursue light weight, thin profile and high-density interconnection, representing the continuous exploration of ultimate miniaturization. On the other hand, products for AI computing power and servers focus on high frequency, high speed, signal transmission, high-layer stacking and buried & blind via technology, which mark the extreme challenges for data transmission capabilities in the computing era. The R&D of high-end products can never be achieved through empty promotion. The decisive factor for enterprises’ competitiveness is how to convert these cutting-edge technologies into tangible products and realize stable mass production.   Why is stable mass production so difficult?  Professionals in the industry are generally familiar with the basic process flow of blind and buried via technology. It is not hard to produce a few prototypes; the real challenge is maintaining consistent stability throughout high-volume production. 1.Drilling accuracy and depth control Blind vias only connect the outer layers with specific inner layers, while buried vias are completely hidden between inner layers. Laser drilling requires extremely precise depth control. Excessive drilling depth will damage the target layer, whereas insufficient depth will result in failed interlayer connection. The hole diameter is usually ≤ 0.15mm, and the hole position deviation must be controlled within ±0.02mm. Any deviation beyond the tolerance will cause misalignment between vias and circuits, sharply increasing the risk of open circuits. 2.Uniformity of electroplated through holes and blind holes Through holes feature a high aspect ratio, which restricts the circulation of electrolyte inside the holes and easily causes uneven plating thickness. For AI server applications, the electroplated copper thickness on the inner walls of buried and blind vias shall be no less than 25μm, with surface copper thickness deviation controlled within ±3μm. Insufficient copper thickness will directly reduce current carrying capacity. 3.Control of layer alignment in multi-layer lamination High-end HDI boards often require multiple lamination cycles for completion. Each lamination process carries the risk of interlayer offset. If the interlayer alignment error exceeds ±25μm, the stability of signal transmission will be compromised.   Second-order HDI boards generally need three times of lamination. With each additional lamination step, the production yield typically drops by approximately 5% to 10%. 4.Differentiated challenges brought by high-frequency and high-speed materials The layer count of HDI boards for AI servers has evolved from the conventional 20 layers to 40 layers, and even 60 to 78 layers. The number of buried and blind vias can exceed 5,000 per square meter. High-frequency and high-speed materials are required, such as M9-grade ultra-low loss materials (Dk＜3.0), to support high-frequency and high-speed signal transmission. From consumer electronics to AI computing power hardware, the technical difficulty has achieved leaping upgrades.   Only stable mass production capability is the absolute truth. 1.Three Core Indicators of Mass Production Capability Yield stability: The mass production yield shall remain steadily above 98% with a fluctuation range of less than 1%. Otherwise, it will lead to out-of-control costs. Delivery consistency: Deviations in hole position accuracy, copper thickness uniformity and electrical performance of products from different batches must be controlled within ±5%. Cost controllability: On the premise of ensuring quality, control the unit cost within the customer’s acceptable range to avoid losing market share due to excessive costs. Maintaining a mass production gross profit margin above 30% represents sound cost control. 2.How to Improve Mass Production Capability Process standardization: Solidify the parameters of each process into standardized operating procedures (SOP) to reduce discrepancies caused by manual operation. Equipment automation: Adopt fully automatic laser drilling machines, electroplating lines and AOI inspection equipment to improve production efficiency and product consistency. Professional talent team: Cultivate interdisciplinary talents with comprehensive capabilities in design, process and quality control to quickly handle unexpected on-site production issues. Supply chain collaboration: Establish in-depth cooperation with material and equipment suppliers to secure high-quality raw materials and equipment in advance, ensuring stable supply. The R&D of high-end products relies not on empty boasting, but on steadily refining every process detail step by step, ultimately transforming cutting-edge technologies into stable mass production that is repeatable, scalable and profitable.     With unwavering commitment to stable mass production and superior quality, our company is a trusted leader in PCB manufacturing. We specialize in a full range of high-performance products, including FPC Flexible Board Series & Soft-Hard Combination Board Series, OSP Antioxidant Board, Nickel Gold Plate Series, Spray Tin Plate Series, FR-4 Multilayer Circuit Board, and FR-4, CEM-3 Double-sided Circuit Board. Backed by mature buried and blind via technology—core to high-layer and multi-layer PCB manufacturing—we translate cutting-edge technical strength into consistent, reliable products. Our strict quality control and standardized production processes ensure each product meets the highest industry standards, delivering stable performance and long-term value for customers across various fields.

Zhejiang Lingchao Electronic Technology is realigning its product mix to capture the PCB industry's rebound. Market Context: Global PCB output fell 15% to $69.5B in 2023 amid destocking, but AI demand is fueling 5% growth in 2024. China maintains 50%+ global share at $37.8B. Long-term trajectory points to $90.4B by 2028. Server market recovery—2.05% growth projected for 2024 after 2023's 6% decline—is driving high-layer board demand. Aspeed revenue trends and Inventec guidance confirm the upturn. Lingchao's strategy: leverage full-range capability while concentrating R&D investment on high-layer multi-layer boards for premium segments.

As the global PCB (Printed circuit board) industry enters a new growth cycle, Zhejiang Lingchao Electronic Technology Co., LTD (Lingchao Electronics), a professional circuit board R&D and production manufacturer, actively adjusts product layout and strengthens technological innovation to seize market opportunities brought by industry recovery. According to circuit layer classification, Printed circuit board includes Single sided electronic circuit board, Double sided electronic circuit board and Multi-layer electronic circuit board. Single sided electronic circuit board, the most basic Electronic board, is used in ordinary household appliances and remote controls; Double sided electronic circuit board is applied in consumer electronics, automotive electronics and industrial control; Multi-layer electronic circuit board (4-6 layers, 8-16 layers, 18+ layers) is suitable for complex scenarios, with high-layer boards used in communication equipment, high-end servers and military fields. Affected by destocking and interest rate hikes, global PCB output value dropped 15% year-on-year to $69.517 billion in 2023 (Prismark data). With inventory adjustment and AI development, the industry will grow 5% year-on-year in 2024. Long-term outlook: 2028 global output value is expected to reach $90.413 billion, with a 5.4% CAGR from 2023 to 2028. China’s PCB industry develops steadily: 2023 mainland output value was $37.794 billion, accounting for over 50% of the global market. The upgrading and demand recovery of general servers further increase the demand for Multi-layer electronic circuit board. The global server market is recovering. 2022 shipments reached 14.17 million units (up 4.7% YoY), while 2023 dropped 6.0% to 13.32 million units. Trendforce predicts 2.05% YoY growth in 2024. Indicators like Aspeed Technology’s revenue and Inventec’s statement confirm the recovery, driving demand for Multi-layer electronic circuit board. Adhering to "technology first, quality-oriented", Lingchao Electronics has a complete product line covering all three types of PCB. It focuses on high-layer Multi-layer electronic circuit board R&D to meet high-end demand, and will optimize product structure to achieve better development in the new growth cycle.

In the high-stakes world of PCB manufacturing, copper foil is far more than a commodity—it is the backbone of signal integrity. As we push the boundaries of 5G, AI servers, and autonomous driving, the choice of copper foil dictates the performance ceiling of your electronic design. From standard conductivity to ultra-low signal loss, understanding the evolution from HTE to HVLP is essential for engineering the next generation of technology. The Technology Spectrum: Precision Engineering The difference between these foils lies in their surface morphology. We have moved beyond simple conductivity to mastering the "skin effect"—where signal loss happens. HTE (High-Temperature Elongation): The Reliability Standard The Workhorse: Designed for robustness. HTE foil uses a roughened surface to maximize peel strength and adhesion. Best For: High-reliability multilayer boards where thermal cycling resistance is paramount. It is the economical, proven choice for general applications. RTF (Reverse Treated Foil): The Balanced Performer The Optimizer: By reversing the treatment process, RTF offers a smoother signal path than HTE while maintaining strong adhesion. Best For: High-speed digital circuits requiring a balance between cost-efficiency and improved signal performance. VLP (Very Low Profile): The Signal Guardian The Specialist: Engineered with significantly lower surface roughness. VLP minimizes the "bumps" that disrupt high-frequency signals. Best For: Substrates and packaging boards where signal integrity begins to take precedence over raw mechanical bonding. HVLP (Hyper Very Low Profile): The Apex of Performance The Game Changer: With ultra-smooth surfaces (Rz ≤ 2.0μm), HVLP virtually eliminates skin effect losses. Best For: The most demanding applications—AI Data Centers, 800G Networks, and 5G Infrastructure. This is the premium choice for ultra-low loss requirements. Note on Terminology: While "VLP" is the standard for low-profile needs, "HVLP" represents the cutting edge of smoothness. In some regions, terminology may vary slightly, but the performance hierarchy remains clear.

In the field of PCB manufacturing, copper foil is one of the most fundamental materials, serving key functions such as conducting electricity, dissipating heat, transmitting signals, acting as a seed layer for copper plating, and providing mechanical support. Common types include HTE copper foil, RTF copper foil, VLP copper foil, and HVLP copper foil. What are the differences between them? In which fields are they applied? And how should they be selected? Both HTE and RTF are electrodeposited copper foils. The core differences lie in their surface morphology and process design, which determine the trade-offs between adhesion, high-frequency loss, and cost. PCB selection is determined by the application scenario. I. Core Definitions and Process Differences HTE (High-Temperature Elongation) Electrodeposited Copper FoilA traditional electrodeposited copper foil. The roughened side faces up and bonds with the resin to achieve high peel strength. It offers good elongation under high-temperature lamination, providing strong resistance to copper cracking and thermal cycling. RTF (Reverse Treated Foil)The process is reversed: the smooth side faces down and bonds with the substrate, followed by fine micro-roughening. The two sides are treated differently to balance adhesion and signal loss. VLP Copper Foil Full Name: Very Low Profile Key Features and Positioning: It has relatively low surface roughness and serves as a foundational low-profile copper foil, primarily used in applications requiring high signal integrity. It is widely used in substrates for packaging boards and similar applications. HVLP Copper Foil Full Name: Hyper Very Low Profile Key Features and Positioning: It features extremely low surface roughness (typically Rz ≤ 2.0 μm). As an advanced version of VLP, it is specifically designed for high-frequency, high-speed circuits requiring very low or ultra-low loss, offering the highest performance and cost. Note: There can be slight variations in industry terminology. The full name "Hyper Very Low Profile" is clearly defined for HVLP, distinguishing it from "high voltage." Additionally, in terms of Chinese naming, manufacturers in the Taiwan region sometimes refer to VLP as "ultra-low profile" copper foil. III. Application Field Differences Technical Core: Compared to traditional HTE copper foil and improved RTF copper foil, the core pursuit of VLP/HVLP is to minimize the surface roughness at the interface between the copper foil and resin. This minimizes the "skin effect" loss during high-frequency signal transmission. Performance Gradient: In terms of signal transmission performance (specifically low loss) and cost, these copper foil types generally follow this progression: HTE Copper Foil: Standard performance, economical and general-purpose. RTF Copper Foil: Improved performance with good cost-effectiveness, widely used in mid-loss and low-loss circuits. VLP Copper Foil: Higher performance for high-frequency, high-speed circuits. HVLP Copper Foil: Top-tier performance, specifically designed for very low-loss and ultra-low-loss circuits. Application Selection: The choice of copper foil directly depends on the signal frequency and loss requirements of the circuit board: Mainstream Communications & High-Speed Computing: Applications like 5G base stations, high-end routers, data center servers (using PCIe 5.0, 800G networks, etc.) typically use HVLP copper foil. High-End Consumer Electronics & Automotive Networking: Applications like high-end smartphone mainboards, autonomous driving radars, and automotive high-speed gateways may use advanced RTF or VLP/HVLP copper foils depending on specific loss requirements. General Consumer Electronics & Automotive Control: Applications like home appliances and body control modules can be satisfied with standard HTE copper foil or standard RTF copper foil. You can consider VLP as the standard answer for low-profile copper foil, while HVLP represents the optimal answer for pursuing ultra-low frequency loss. Currently, driven by the development of 5G, AI data centers, and autonomous driving, the market demand for ultra-low profile copper foils like HVLP is growing rapidly.

WENZHOU, CHINA – March 21, 2026 – Zhejiang Leading Tide Electronics Technology Co., Ltd., a pioneer in China’s printed circuit board (PCB) manufacturing industry, has recently reaffirmed its leading position in the sector through continuous technological upgrading, expanded production capacity, and strict quality control. With nearly three decades of development, the company has grown from a small family workshop into a large-scale enterprise specializing in various high-quality circuit board products, serving global customers in multiple high-tech fields. Located in Pingyang Binhai New Area, Wenzhou City, Zhejiang Province—a region boasting convenient transportation, superior geographical location, and comprehensive supporting facilities—Zhejiang Leading Tide Electronics Technology Co., Ltd. is an early-established enterprise in China dedicated to the production of various single-sided, double-sided, and aluminum-based PCBs. Since its founding in 1993, the company has undergone several important development milestones: initially registered as "Ruian Boteli Circuit Board Factory" in 1998, relocated to Cangnan County and renamed "Cangnan Boteli Electronics Co., Ltd." in 2007, and finally moved to its current new facilities in Pingyang Binhai New Area in 2015, rebranding as its present name. This journey of development has witnessed the company’s steady growth from a small-scale operation to a industry leader. With a total investment of approximately RMB 100 million, the company covers an area of 30 mu (about 2 hectares), with a built-up area of 50,000 square meters and a team of over 300 employees. Its core business focuses on manufacturing high-quality electronic board products, including single sided electronic circuit board, double sided electronic circuit board, and multi-layer electronic circuit board, as well as aluminum-based PCBs. These products are widely used in high-tech fields such as communication equipment, automotive electronics, home appliances, financial devices, medical instruments, LED lighting, consumer electronics, computer products, and industrial control systems, catering to both the Chinese market and international markets including Europe, North America, and parts of the Asia-Pacific region. To ensure product quality and technological advancement, the company has invested heavily in advanced intelligent production lines and inspection equipment. Its production workshop is equipped with automatic optical inspection machines, AOI optical scanning/repair systems, precision image measurement systems, metallographic microscopes, automated test equipment, four-wire and two-wire flying probe testers, CNC drilling machines, CNC milling machines, laser direct imaging (LDI) exposure machines, VOP automatic plating lines (vertical continuous copper plating), dry film automatic laminating machines, and DES (developing, etching, stripping) lines. In addition, the company has developed cutting-edge processes such as lead-free HASL, ENIG, immersion tin, immersion silver, ENEPIG, and OSP for lead-free products, meeting the strict quality requirements of global customers. The company’s commitment to quality and innovation has been widely recognized by the industry and authorities. It has obtained IATF 16949 & ISO 9001 quality management system certifications, ISO 14001 environmental management system certification, CQC mark certification, UL product certification, and has been honored as a National High-Tech Enterprise and an Innovation Star. These certifications not only demonstrate the company’s strict quality control system but also enhance its competitiveness in the global printed circuit board market. Adhering to the corporate philosophy of "integrity as the foundation, quality for survival, technological innovation, and pursuit of industry leadership," Zhejiang Leading Tide Electronics Technology Co., Ltd. is committed to building a professional team and providing integrated PCB services to customers with its advantageous location, streamlined delivery processes, and comprehensive technical capabilities. Looking ahead, the company will continue to focus on technological innovation, expand its product range, and strive to become a global leader in the circuit board manufacturing industry, contributing to the development of the global electronics industry.

As PCBs move towards the era of high frequency and high speed, printed circuit boards are no longer just the "base" that supports components. In addition to their conductive function, they also have the function of transmitting high frequency and high speed signals. When we talk about the electrical performance of high-speed PCBs, dielectric constant (Dk), loss factor (Df), characteristic impedance (Z0), and insertion loss are four unavoidable keywords. They are interrelated and together determine the transmission quality of signals on the circuit board.   1、 The definition and units of the four major indicators 1. Dielectric constant (Dk/ε r): The dielectric constant of the "deceleration zone" of a signal is a physical quantity that measures the ability of a material to store electrical energy under the action of an electric field. Simply put, it reflects the degree of "obstruction" that a signal experiences when propagating through a medium. Its definition is usually the ratio of the capacity of a capacitor made of this material as a medium to the capacity of a capacitor of the same size made of vacuum as a medium, so it is a dimensionless relative value (usually expressed as ε r).   ·Numerical significance: The Dk of common FR-4 sheets is between 4.2 and 4.8, while the Dk of high-frequency sheets such as PTFE (polytetrafluoroethylene, commonly known as Teflon, Teflon) is usually between 2.2 and 3.0. The lower and more stable the Dk value, the faster the signal propagation speed, and the more favorable it is for high-frequency transmission.   2. Loss factor (Df/tan δ): The "thief" loss factor of energy, also known as the dielectric loss tangent or dissipation factor, is a parameter used to characterize the energy loss of dielectric materials in alternating electric fields due to the hysteresis effect or leakage caused by dielectric polarization. It represents the ratio of the portion of signal energy that "leaks" into the insulation board to the energy stored in the board, and is also a dimensionless physical quantity.   ·Numerical meaning: The smaller the Df value, the better. The Df of ordinary FR-4 is usually around 0.02, while the Df of high-frequency high-speed materials (such as Rogers RO4350B) can be as low as 0.0037 or even lower. The smaller the Df, the smaller the signal heating and attenuation caused by the material itself.   3. Characteristic impedance (Z0): The characteristic impedance of the "ID card" of the transmission line is the ratio of the instantaneous voltage to the instantaneous current encountered when the signal propagates on the transmission line, measured in ohms (Ω). It is not a simple DC resistor, but a comprehensive characteristic determined by the distributed resistance (R), inductance (L), conductance (G), and capacitance (C) of the transmission line. In high-frequency environments, the characteristic impedance can be approximately simplified as Z0=√ (L/C).   ·Numerical significance: In PCB design, the common impedance control for single ended signal lines is 50 Ω or 75 Ω, while differential signals are usually 90 Ω or 100 Ω. Maintaining impedance continuity (i.e. impedance matching) is the key to preventing signal reflection. 4. Insertion Loss (IL): The "road toll" of a signal. Insertion loss refers to the degree of attenuation of output power relative to input power after a signal passes through a transmission line, typically expressed in decibels (dB). It is a macroscopic final performance indicator that directly reflects the "cost" the signal incurs on its transmission path. Its mathematical definition is S21 = -10 * log(Po/Pi), where Pi is the input power and Po is the output power.    · Numerical significance: The smaller the absolute value of insertion loss, the better (i.e., the closer the dB value is to 0). For example, an insertion loss of -3dB means that the signal power is lost by half. In practical testing, the unit of insertion loss is usually db/inch. Why is it like this? In engineering applications, for standardized measurement, insertion loss is usually accompanied by a length unit (such as dB/inch or dB/cm), but in theoretical definitions and system link budgets, it is a pure dB value.    · Why is it usually written as dB/inch (or dB/cm): "Specific conditions" in the definition. The essence of insertion loss is the attenuation ratio of output power relative to input power. Since the longer the signal travels on the transmission line, the greater the attenuation, it is meaningless to simply say "the insertion loss is 3dB" - it must be specified on what length of transmission line it was measured. Therefore, in order to standardize the performance of materials in data sheets, manufacturers usually normalize the insertion loss to unit length, with common units including: · dB/inch: inches, commonly used by American sheet manufacturers (such as Rogers and Isola). · dB/cm: centimeters, commonly used by European and Asian manufacturers. · dB/m: meters, mainly used for describing very low-loss RF cables. · Why there is confusion: Context of the two expressions · Material property context (unit length dB): When we select materials, saying "the insertion loss of material A is 0.7dB/inch @ 10GHz" refers to the attenuation of 0.7dB per inch of transmission line at 10GHz frequency. This reflects the loss characteristics of the material itself. · System link context (total dB): When designers calculate the total attenuation of an actual transmission line (such as a 10-inch-long trace), they calculate it as 0.7dB/inch × 10 inch = 7dB (plus other losses such as connectors). At this point, the "total insertion loss of this link is 7dB" does not include the length unit, because it is the total attenuation value of the specific path. · Conversion and supplementary explanation · These two units are convertible: · 1 dB/inch ≈ 0.394 dB/cm · 1 dB/cm ≈ 2.54 dB/inch For simulation software or network analyzer testing, although the final displayed curve axis unit is dB, when setting the length of the device under test, the instrument has already considered the length factor through techniques such as "de-embedding", and the calculated result is actually the total loss dB value under the specific path.    When referring to "insertion loss of a material", it is usually accompanied by a length unit (such as dB/inch) to facilitate comparison of the merits of different materials. When referring to "insertion loss of a specific channel", it is usually simply written as dB, indicating the total attenuation of that path

Writing a tender chapter amidst precision circuits, showcasing the elegance of women on the wave of technology. On the occasion of the 116th International Women's Day, Zhejiang Lingchao Electronic Technology Co., Ltd. extends its sincerest holiday greetings and highest respect to all female employees!   As a leading enterprise deeply rooted in the PCB industry for nearly three decades, Zhejiang Lingchao Electronic Technology Co., Ltd. (formerly established as Ruian Boteli Circuit Board Factory in 1998) has gradually grown from a small family workshop into a national high-tech enterprise, boasting a modern factory area of 50,000 square meters, over 300 employees, and products exported to Europe, America, and the Asia-Pacific region. Throughout this nearly thirty-year development journey, every leap forward and every achievement of the company has been inseparable from the hard work and outstanding contributions of all its female employees.   Numerous outstanding women are active in Lingchao Electronics' production workshops, R&D laboratories, sales frontlines, and management positions. They control the quality of every circuit board with rigorous and meticulous care, overcome technical R&D challenges with an innovative and enterprising spirit, and win the trust of domestic and international clients with professional and efficient service. They integrate the unique female qualities of delicacy, resilience, and wisdom into the intricate circuit designs and stringent production processes. Within the framework of international quality management systems such as IATF 16949 and ISO 9001, they have helped the company earn honors like "National High-tech Enterprise" and "Innovation Star," infusing the brand promise of "Lingchao Circuit Boards, World-Class Quality" with warm and steadfast strength.   "Writing a tender chapter amidst precision circuits." This is not only Lingchao Electronics' praise for its female employees but also a high affirmation of their professional value. In high-tech fields such as automotive electronics, medical instruments, LED lighting, and communication equipment, Lingchao Electronics' products are ubiquitous, and behind these products lies the hard work and dedication of countless female employees. With their professionalism and responsibility, they have broken the gender labels often found in the technology industry, proving with their capabilities the boundless potential of "her strength" in the era of intelligent manufacturing.   The company's General Manager stated, "Women are Lingchao Electronics' most precious asset and a core force driving the company's high-quality development. We are always committed to creating an equal, inclusive, and empowering work environment for all female employees, supporting them in realizing their self-worth on their career paths and blossoming with unique brilliance."   In the future, Zhejiang Lingchao Electronic Technology Co., Ltd. will continue to uphold its corporate philosophy of "Integrity as the Foundation, Quality as the Core, Technological Innovation, and Industry Leadership." It will march forward hand in hand with all its female employees, braving the waves in the PCB industry, and together write an even more glorious chapter, allowing the flowers of womanhood to continuously bloom at the forefront of technology!   Zhejiang Lingchao Electronic Technology Co., Ltd. March 8, 2026

Zhejiang Leading Tide Electronics: Where Circuits Connect Innovation Wenzhou, Zhejiang, China – March 5, 2026​ – In the heartbeat of China’s advanced manufacturing sector, Zhejiang Leading Tide Electronics Technology Co., Ltd. powers progress with precision. From its strategic base in the modern Pingyang Binhai New Area, the company has grown from a humble workshop in 1998 into a 300-strong, 50,000-square-meter hub of technological excellence, backed by a RMB 100 million investment. Specializing in the art and science of the printed circuit board, Leading Tide manufactures a comprehensive range of high-reliability boards. Its portfolio includes robust Double sided electronic circuit board, sophisticated Multi-layer electronic circuit board, and specialized Electronic board​ solutions that serve as the nervous system for automotive, medical, communication, consumer electronics, and industrial applications worldwide. The company’s evolution is mirrored in its technological advancement. Equipped with laser direct imaging, automated optical inspection, and intelligent plating lines, every board is crafted under exacting standards. With IATF 16949, ISO 9001, and UL certifications, alongside recognition as a National High-Tech Enterprise, Leading Tide blends innovation with integrity. Driven by a philosophy of “quality for survival and innovation for leadership,” the company delivers more than components—it delivers confidence. As a partner to brands across China, Europe, North America, and Asia-Pacific, Zhejiang Leading Tide is wiring the future, one circuit board​ at a time.

Zhejiang Leading Tide Electronics Technology Co., Ltd.: A Pioneer in Advanced PCB Manufacturing and Innovation Wenzhou, Zhejiang, China – February 28, 2026​ – Zhejiang Leading Tide Electronics Technology Co., Ltd. stands as one of China’s early-established enterprises specializing in the production of printed circuit boards. With a history dating back to 1998, the company has grown from a small family workshop into a prominent manufacturer with a total investment of approximately RMB 100 million, occupying a 30-mu (about 2-hectare) site and employing over 300 professionals. Located in Pingyang Binhai New Area, Wenzhou, the facility benefits from strategic transport access and comprehensive supporting infrastructure. The company’s core expertise lies in the manufacturing of high-quality Printed circuit board, including Double sided electronic circuit board, Multi-layer electronic circuit board, and aluminum-based PCBs. These products are widely applied in communication equipment, automotive electronics, home appliances, medical instruments, LED lighting, consumer electronics, and industrial control systems. Serving both domestic and international markets, Leading Tide exports to Europe, North America, and the Asia-Pacific region. Since its establishment, the company has invested in advanced intelligent production and inspection equipment, including automatic optical inspection (AOI) systems, laser direct imaging (LDI) exposure machines, CNC drilling and milling machines, VOP automatic plating lines, and DES lines. It also employs cutting-edge surface finishes such as ENIG, immersion silver, and OSP for lead-free products. Certified with IATF 16949, ISO 9001, ISO 14001, CQC, and UL, and recognized as a National High-Tech Enterprise, Leading Tide adheres to a corporate philosophy centered on integrity, quality, innovation, and industry leadership. Supported by a skilled team and efficient processes, the company delivers integrated PCB solutions that meet the evolving demands of global industries.